Loading...

LMV225TL/NOPB

Texas Instruments

LMV225TL/NOPB by Texas Instruments

LMV225TL/NOPB by Texas Instruments is a Cellphone IC with 4 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 2.7V and max supply current of 8mA, making it ideal for cellphone applications.

Median Price

$1.456

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 158,162 parts In-Stock

1+ parts

$1.456

100+ parts

$1.203

1k+ parts

$0.650

10k+ parts

-

158,162

$1.456

$1.203

$0.650

-

DigiKey

USA . 950 parts In-Stock

1+ parts

$1.890

100+ parts

$1.130

1k+ parts

$1.005

10k+ parts

$0.932

950

$1.890

$1.130

$1.005

$0.932

Mouser Electronics

USA . 60 parts In-Stock

1+ parts

$1.890

100+ parts

$1.140

1k+ parts

$0.970

10k+ parts

$0.931

60

$1.890

$1.140

$0.970

$0.931

Rochester

USA . 2,399 parts In-Stock

1+ parts

-

100+ parts

$1.170

1k+ parts

$0.971

10k+ parts

$0.866

2,399

-

$1.170

$0.971

$0.866

Verical

USA . 2,399 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.214

10k+ parts

$1.082

2,399

-

-

$1.214

$1.082

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,203 parts In-Stock

1+ parts

$0.858

100+ parts

-

1k+ parts

-

10k+ parts

-

1,203

$0.858

-

-

-

Vyrian

USA . 2,034 parts In-Stock

1+ parts

$0.903

100+ parts

-

1k+ parts

-

10k+ parts

-

2,034

$0.903

-

-

-

Anansix

USA . 2,475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,475

-

-

-

-

DigiKey Marketplace

USA . 899 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

899

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,091 parts In-Stock

1+ parts

$0.813

100+ parts

-

1k+ parts

-

10k+ parts

-

3,091

$0.813

-

-

-

Component Stockers USA

USA . 197,766 parts In-Stock

1+ parts

$0.920

100+ parts

$0.860

1k+ parts

$0.690

10k+ parts

$0.690

197,766

$0.920

$0.860

$0.690

$0.690

Parana Technologies

USA . 2,138 parts In-Stock

1+ parts

$12.898

100+ parts

-

1k+ parts

$13.383

10k+ parts

-

2,138

$12.898

-

$13.383

-

DigiPath Technology Company

USA . 2,300 parts In-Stock

1+ parts

$14.202

100+ parts

-

1k+ parts

-

10k+ parts

-

2,300

$14.202

-

-

-

ChromeModa Solutions

Germany . 6,147 parts In-Stock

1+ parts

$14.492

100+ parts

$11.883

1k+ parts

-

10k+ parts

-

6,147

$14.492

$11.883

-

-

IDEA Electronic Components Group

UK . 2,259 parts In-Stock

1+ parts

$14.492

100+ parts

$13.767

1k+ parts

$13.043

10k+ parts

-

2,259

$14.492

$13.767

$13.043

-

Perfect Parts

USA . 15,760 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,760

-

-

-

-

Overview

Experience the cutting-edge technology and superior quality of Texas Instruments with the LMV225TL/NOPB cellphone IC. This innovative product is designed for maximum performance and reliability, making it ideal for a wide range of applications in the telecommunications industry. With its compact design and advanced features, this IC offers customers unparalleled value, benefits, and advantages. Trust Texas Instruments to deliver excellence with the LMV225TL/NOPB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making it suitable for portable electronics like cellphones.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, ideal for space-constrained applications like cellphones.

No. of Terminals: 4

Having a small number of terminals simplifies the design and integration process, reducing complexity and potential points of failure.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without sacrificing performance.

Terminal Finish: TIN SILVER COPPER

The terminal finish of Tin Silver Copper provides good conductivity and corrosion resistance, ensuring reliable connections in the long run.

Maximum Supply Current: 8 mA

Low supply current means efficient power consumption, making this product energy-efficient and suitable for battery-powered devices like cellphones.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The combination of RF and Baseband circuitry in one IC enhances integration and performance in telecommunications applications, improving overall efficiency.

Nominal Supply Voltage: 2.7 V

Operating at a low nominal supply voltage helps reduce power consumption and heat dissipation, contributing to longer battery life and improved efficiency.

Technical Specifications

Cellphone ICs LMV225TL/NOPB attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B4

JESD-609 Code:

e1

Length:

1.014 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Maximum Supply Current:

8 mA

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.014 mm

Trade Compliance

LMV225TL/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20