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HMC380QS16GE

Analog Devices

HMC380QS16GE by Analog Devices

Analog Devices' HMC380QS16GE is a cellphone IC with 16 terminals in a small outline package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,389 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,389

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Digiode

USA . 732 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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732

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 3,902 parts In-Stock

1+ parts

$12.364

100+ parts

-

1k+ parts

$11.499

10k+ parts

-

3,902

$12.364

-

$11.499

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IDEA Electronic Components Group

UK . 1,096 parts In-Stock

1+ parts

$13.295

100+ parts

$12.630

1k+ parts

$12.630

10k+ parts

-

1,096

$13.295

$12.630

$12.630

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AZTECH Wire

Italy . 660 parts In-Stock

1+ parts

$17.937

100+ parts

-

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660

$17.937

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DigiPath Technology Company

USA . 1,885 parts In-Stock

1+ parts

$20.740

100+ parts

$19.911

1k+ parts

-

10k+ parts

$19.911

1,885

$20.740

$19.911

-

$19.911

Semicontronic

India . 1,646 parts In-Stock

1+ parts

$101.000

100+ parts

$98.475

1k+ parts

$97.970

10k+ parts

-

1,646

$101.000

$98.475

$97.970

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One Stop Electronics

USA . 205 parts In-Stock

1+ parts

$427.000

100+ parts

-

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205

$427.000

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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4,000

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Corphita

USA . 208 parts In-Stock

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208

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Overview

Enhance the performance of your cellphone with the HMC380QS16GE by Analog Devices. Manufactured with precision and expertise, this RF and baseband circuit IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this small outline, shrink pitch package provides customers with exceptional value and benefits. Upgrade your device today with the HMC380QS16GE and experience seamless connectivity and enhanced functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and lightweight construction, making the product ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards.

Package Shape: RECTANGULAR

Rectangular shape provides compatibility with standard PCB layouts, making integration into existing designs seamless.

No. of Terminals: 16

Sufficient number of terminals for connecting various components and ensuring proper functionality of the product.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style helps in saving space on the PCB and enables compact designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even under challenging environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments without affecting performance.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and ensures good electrical conductivity for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit board layout and facilitates proper connection of components.

Maximum Seated Height: 1.75 mm

Low maximum seated height contributes to slim and sleek device designs.

Width: 3.9 mm

Compact width dimension saves space on the PCB and enables smaller overall product size.

Length: 4.9 mm

Short length dimension facilitates space-saving designs and efficient use of PCB real estate.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Terminal Form: GULL WING

Gull wing terminal form aids in easy soldering onto the PCB and provides mechanical strength to the connections.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Integration of RF and baseband circuits in one IC helps in efficient communication and signal processing in telecom applications.

Nominal Supply Voltage: 5 V

Stable 5V supply voltage ensures consistent performance of the IC under various operating conditions.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for more terminals in a compact space, enabling higher functionality in a smaller package.

Technical Specifications

Cellphone ICs HMC380QS16GE attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

HMC380QS16GE Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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