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HMC381LP6TR

Analog Devices

HMC381LP6TR by Analog Devices

Analog Devices' HMC381LP6TR is a cellphone IC with 28 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It features RF and baseband circuits, with a nominal voltage of 5V, making it ideal for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,310 parts In-Stock

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4,310

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Digiode

USA . 504 parts In-Stock

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504

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Distributors (Availability)

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Parana Technologies

USA . 1,759 parts In-Stock

1+ parts

$7.016

100+ parts

-

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$6.525

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1,759

$7.016

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$6.525

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IDEA Electronic Components Group

UK . 2,174 parts In-Stock

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$7.544

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$7.167

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2,174

$7.544

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$7.167

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DigiPath Technology Company

USA . 1,542 parts In-Stock

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$11.769

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$11.298

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$11.298

1,542

$11.769

$11.298

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$11.298

AZTECH Wire

Italy . 465 parts In-Stock

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$13.513

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465

$13.513

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One Stop Electronics

USA . 1,310 parts In-Stock

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$729.000

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1,310

$729.000

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Semicontronic

India . 1,499 parts In-Stock

1+ parts

$889.000

100+ parts

$866.775

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$862.330

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1,499

$889.000

$866.775

$862.330

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QUARKTWIN TECHNOLOGY LTD

USA . 27,224 parts In-Stock

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Corphita

USA . 767 parts In-Stock

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Overview

Experience unparalleled performance with the HMC381LP6TR by Analog Devices. As a leader in cellphone ICs, Analog Devices delivers cutting-edge technology in a compact and durable package. Ideal for RF and baseband circuits, this chip carrier boasts a very thin profile and industrial-grade temperature tolerance. Trust Analog Devices to provide high-quality solutions for all your telecom needs. Elevate your projects with the HMC381LP6TR and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product suitable for mobile applications.

Surface Mount: YES

Surface mount capability makes installation easier and more efficient, saving time and effort during assembly.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy alignment during assembly.

No. of Terminals: 28

The high number of terminals provides ample connectivity options and versatility in design.

Max Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand challenging environmental conditions.

Min Operating Temperature: -40 °C

The low minimum operating temperature ensures reliability even in extreme cold environments.

Terminal Position: QUAD

Quad terminal position offers robust connectivity and stability during operation.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V is common and widely available, making this product easy to integrate into existing systems.

Technical Specifications

Cellphone ICs HMC381LP6TR attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N28

Length:

6 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

HMC381LP6TR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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