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TRF371135IRGZR

Texas Instruments

TRF371135IRGZR by Texas Instruments

TRF371135IRGZR by Texas Instruments is a 48-terminal cellphone IC with a 5V supply voltage. It features RF and baseband circuits, operates in industrial temperature range (-40 to 85°C), and has a package style of chip carrier. Ideal for telecom applications requiring high-performance RF solutions.

Median Price

$18.652

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,000 parts In-Stock

1+ parts

$17.916

100+ parts

$15.650

1k+ parts

$10.793

10k+ parts

-

7,000

$17.916

$15.650

$10.793

-

Rochester

USA . 2,483 parts In-Stock

1+ parts

-

100+ parts

$15.510

1k+ parts

$13.880

10k+ parts

$13.060

2,483

-

$15.510

$13.880

$13.060

DigiKey

USA . 2,483 parts In-Stock

1+ parts

-

100+ parts

$20.410

1k+ parts

-

10k+ parts

-

2,483

-

$20.410

-

-

Verical

USA . 2,483 parts In-Stock

1+ parts

-

100+ parts

$19.387

1k+ parts

$17.350

10k+ parts

$16.325

2,483

-

$19.387

$17.350

$16.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,951 parts In-Stock

1+ parts

$14.240

100+ parts

-

1k+ parts

-

10k+ parts

-

2,951

$14.240

-

-

-

Vyrian

USA . 7,010 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,010

-

-

-

-

DigiKey Marketplace

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 393 parts In-Stock

1+ parts

$9.949

100+ parts

$923.944

1k+ parts

$8.954

10k+ parts

-

393

$9.949

$923.944

$8.954

-

DigiPath Technology Company

USA . 836 parts In-Stock

1+ parts

$10.955

100+ parts

$10.079

1k+ parts

-

10k+ parts

-

836

$10.955

$10.079

-

-

ChromeModa Solutions

Germany . 2,697 parts In-Stock

1+ parts

$11.179

100+ parts

$9.167

1k+ parts

-

10k+ parts

-

2,697

$11.179

$9.167

-

-

IDEA Electronic Components Group

UK . 2,119 parts In-Stock

1+ parts

$11.179

100+ parts

$10.620

1k+ parts

$10.061

10k+ parts

-

2,119

$11.179

$10.620

$10.061

-

Corphita

USA . 3,205 parts In-Stock

1+ parts

$13.491

100+ parts

-

1k+ parts

-

10k+ parts

-

3,205

$13.491

-

-

-

Overview

Elevate your cellphone's performance to new heights with the TRF371135IRGZR from Texas Instruments. Known for their top-notch quality and innovation, Texas Instruments delivers a cutting-edge Cellphone IC that promises seamless integration and superior functionality. This versatile chip, featuring a sleek square package design, is ideal for RF and baseband circuits, ensuring optimal performance for your device. With a wide operating temperature range and advanced terminal finish, this IC offers reliability and durability like no other. Upgrade your cellphone experience today with the TRF371135IRGZR and enjoy enhanced efficiency and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the cell phone IC, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable makes the installation process easier and more efficient.

Power Supplies (V): 5

Suitable voltage supply for optimal performance of the cellphone IC.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board.

Maximum Operating Temperature: 85 °C

Ability to operate at a high temperature range allows for reliable performance in various conditions.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for use in different environments.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Supports both RF and baseband circuits, providing versatility in communication functions.

Nominal Supply Voltage: 5 V

Stable supply voltage ensures consistent and reliable operation of the cell phone IC.

Technical Specifications

Cellphone ICs TRF371135IRGZR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TRF371135IRGZR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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