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TRF3702IRHCR

Texas Instruments

TRF3702IRHCR by Texas Instruments

TRF3702IRHCR by Texas Instruments is a cellphone IC with 16 terminals, operating at -40 to 85°C. It features a supply voltage of 5V, RF and baseband circuit for telecom applications, and terminal pitch of 0.8mm. The package style is chip carrier with very thin profile, suitable for industrial use in compact devices.

Median Price

$8.740

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 30,216 parts In-Stock

1+ parts

-

100+ parts

$7.560

1k+ parts

$6.770

10k+ parts

$6.370

30,216

-

$7.560

$6.770

$6.370

DigiKey

USA . 30,216 parts In-Stock

1+ parts

-

100+ parts

$8.740

1k+ parts

-

10k+ parts

-

30,216

-

$8.740

-

-

Verical

USA . 15,379 parts In-Stock

1+ parts

-

100+ parts

$9.450

1k+ parts

$8.463

10k+ parts

$7.963

15,379

-

$9.450

$8.463

$7.963

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,880 parts In-Stock

1+ parts

$7.980

100+ parts

-

1k+ parts

-

10k+ parts

-

3,880

$7.980

-

-

-

Vyrian

USA . 2,443 parts In-Stock

1+ parts

$8.400

100+ parts

-

1k+ parts

-

10k+ parts

-

2,443

$8.400

-

-

-

DigiKey Marketplace

USA . 30,216 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30,216

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,034 parts In-Stock

1+ parts

$7.560

100+ parts

-

1k+ parts

-

10k+ parts

-

4,034

$7.560

-

-

-

Parana Technologies

USA . 1,975 parts In-Stock

1+ parts

$8.117

100+ parts

-

1k+ parts

$8.712

10k+ parts

-

1,975

$8.117

-

$8.712

-

DigiPath Technology Company

USA . 1,761 parts In-Stock

1+ parts

$8.938

100+ parts

$8.223

1k+ parts

-

10k+ parts

-

1,761

$8.938

$8.223

-

-

ChromeModa Solutions

Germany . 995 parts In-Stock

1+ parts

$9.120

100+ parts

$7.478

1k+ parts

-

10k+ parts

-

995

$9.120

$7.478

-

-

IDEA Electronic Components Group

UK . 23 parts In-Stock

1+ parts

$9.120

100+ parts

$8.664

1k+ parts

$8.208

10k+ parts

-

23

$9.120

$8.664

$8.208

-

GreenTree Electronics

Israel . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,000

-

-

-

-

Overview

Elevate your cellphone performance with the TRF3702IRHCR by Texas Instruments. Known for their top-notch quality, Texas Instruments delivers innovative solutions that meet the demands of today's technology-driven world. This RF and baseband circuit offers unparalleled reliability and efficiency, making it a must-have for any mobile device. Experience seamless connectivity and enhanced functionality with this cutting-edge IC. Trust Texas Instruments to bring you the best in cellphone IC technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and insulation, making the product resistant to physical damage and electrical interference.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and facilitating automated assembly processes.

Power Supplies (V): 5

Operates with a standard 5V power supply, ensuring compatibility with common power sources and reducing the need for additional voltage regulation components.

Nominal Supply Voltage: 5 V

Consistent supply voltage of 5V ensures stable and reliable performance of the cellphone ICs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the ICs can withstand varying temperature conditions without compromising performance or reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish on terminals provides excellent conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Incorporating RF and baseband circuits in one package simplifies design complexity and improves overall performance of the cellphone ICs for telecommunications applications.

Technical Specifications

Cellphone ICs TRF3702IRHCR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,32

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.17 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TRF3702IRHCR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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