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TRF3701IRHCRG4

Texas Instruments

TRF3701IRHCRG4 by Texas Instruments

TRF3701IRHCRG4 by Texas Instruments is a cellphone IC with 16 terminals, operating at -40 to 85°C. It features a 5V supply voltage, RF and baseband circuit for telecom applications. The chip carrier package has a square shape, measures 4x4mm in size, and is surface mountable.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,953 parts In-Stock

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Vyrian

USA . 3,271 parts In-Stock

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3,271

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Distributors (Availability)

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AZTECH Wire

Italy . 487 parts In-Stock

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$9.689

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487

$9.689

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Parana Technologies

USA . 2,240 parts In-Stock

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$13.830

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$14.315

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ChromeModa Solutions

Germany . 3,408 parts In-Stock

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$15.539

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$12.742

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IDEA Electronic Components Group

UK . 1,549 parts In-Stock

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$15.539

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$14.762

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$13.985

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$13.985

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$18.819

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$18.631

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$17.878

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$18.819

$18.631

$17.878

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One Stop Electronics

USA . 1,252 parts In-Stock

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$890.000

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Corphita

USA . 2,339 parts In-Stock

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DigiPath Technology Company

USA . 1,788 parts In-Stock

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$14.010

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1,788

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Overview

Enhance the performance of your cellphone with the TRF3701IRHCRG4 from Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions in the telecom IC category. This IC offers unmatched value and benefits, providing customers with improved signal processing capabilities and enhanced phone performance. Upgrade your device today with the TRF3701IRHCRG4 and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and cost-effective, making the product suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, saving time and resources during production.

Package Shape: SQUARE

Square shape helps in maximizing space efficiency on the circuit board, allowing for more components to be integrated.

Power Supplies (V): 5

Operates on a standard voltage supply, making it compatible with a wide range of systems.

No. of Terminals: 16

Sufficient number of terminals for connecting to various components and interfaces, enabling versatile functionality.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink, and thin profile design helps in heat dissipation and space-saving, promoting better performance in compact devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability even under demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in both extreme cold and hot environments, enhancing the product's versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides corrosion resistance and good electrical conductivity, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal position facilitates efficient and stable connections, improving overall performance.

Maximum Seated Height: 1 mm

Low seated height enables the product to be used in slim devices without compromising on functionality.

Width: 4 mm

Compact width dimension saves space on the circuit board, allowing for more components to be integrated.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time helps in preventing thermal damage during assembly, ensuring product reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for effective soldering, leading to strong and durable connections.

Length: 4 mm

Compact length dimension contributes to space-saving on the circuit board, ideal for miniaturized devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance makes the product suitable for rugged and harsh environments.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental standards, reducing the product's impact on the environment.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combination of RF and baseband circuits allows for comprehensive communication capabilities, suitable for telecommunications applications.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage ensures compatibility with a wide range of systems and power sources.

Terminal Pitch: 0.8 mm

Narrow terminal pitch enhances connectivity density on the circuit board, enabling more compact designs.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates moderate sensitivity to moisture, prompting proper handling and storage practices to maintain product integrity.

Technical Specifications

Cellphone ICs TRF3701IRHCRG4 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,32

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TRF3701IRHCRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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