Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TRF370417IRGER by Texas Instruments is a cellphone IC with 24 terminals in a square chip carrier package. It operates at -40 to 85°C, with a supply voltage of 5V and max current of 0.245mA. This RF and baseband circuit has a terminal pitch of 0.5mm, suitable for industrial telecom applications.
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$15.190
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Component Sense
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$10.365
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$11.413
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$11.646
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$11.064
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Corphita
$14.390
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$20.870
Plastic/Epoxy material allows for a lightweight and durable package, making it suitable for portable devices like cellphones.
Surface mount capability makes it easier to integrate into circuit boards, saving space and enabling efficient assembly processes.
Square package shape is ideal for maximizing space utilization on a circuit board, contributing to a compact design.
Operating at a standard 5V power supply makes it compatible with common power sources, simplifying integration into various systems.
Having 24 terminals provides ample connectivity options for a range of functions and interface requirements in a cellphone.
The combination of chip carrier, heat sink/slug, and very thin profile package styles offer thermal management and space-saving benefits for enhanced performance.
With a high maximum operating temperature, this IC can withstand demanding conditions without compromising functionality.
The ability to operate at a low temperature ensures reliable performance in various environments, including extreme cold conditions.
The use of nickel palladium gold terminal finish enhances conductivity, corrosion resistance, and solderability for robust and reliable connections.
Quad terminal position enables efficient signal routing and connectivity, contributing to optimized circuit design and performance.
With a low maximum seated height, this IC can be accommodated in slim and compact cellphone designs.
A small terminal pitch of 0.5 mm allows for high-density mounting and space-saving configurations in cellphone circuitry.
Cellphone ICs TRF370417IRGER attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments
JESD-30 Code:
JESD-609 Code:
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TRF370417IRGER Telecommunications trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
LL4148
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
SMBJ18CA
Synsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358M
LM358M by Texas Instruments is an Operational Amplifier with 2 functions, featuring a max input offset voltage of 9000 uV and a nominal voltage of 5 V. It is commonly used in applications requiring high common mode rejection ratio and low bias current, such as sensor interfaces and signal conditioning circuits.
Semtech
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
SS14
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Weitron Technology
Changzhou Starsea Electronics
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
Renesas Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM555CM
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
2N2222A
International Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
American Power Devices
LM317LMX/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Seated Height: 1.75 mm; Nominal Dropout Voltage-1: 3 V;
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
New Jersey Semiconductor Products
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
MBR0520LT1
Onsemi
MBR0520LT1 by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring low power consumption in compact electronic devices. This single-configured diode is surface mountable and has a max repetitive peak reverse voltage of 20V, ideal for small outline package designs.
Vishay Intertechnology
Vishay Intertechnology's LL4148 diode features a max reverse recovery time of 0.004 us, forward voltage of 1 V, and output current of 0.15 A. Ideal for rectification applications in electronics due to its high efficiency and low power dissipation capabilities.
LM107H/883C
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Package Equivalence Code: CAN8,.2;
NRF9160-SIBA-B1A-R7
Nordic Semiconductor Asa
Nordic Semiconductor's NRF9160-SIBA-B1A-R7 is a CELL IC with RF & baseband circuit. It operates in industrial temp range (-40 to 85°C) with 3.8V supply voltage. This surface-mountable chip has 127 terminals, rectangular shape, and grid array package suitable for cellphone applications.
MC13142D
Freescale Semiconductor
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
LMH6521SQ
LMH6521SQ by Texas Instruments is a cellphone IC with 32 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
TRF3762-EIRHAR
TRF3762-EIRHAR by Texas Instruments is a cellphone IC with 40 terminals, operating at -40 to 85°C. It features a supply voltage of 5V, RF and baseband circuitry, and terminal pitch of 0.5mm. Ideal for industrial applications requiring low power consumption and compact design in telecom devices.
TRF4903PWG4
TRF4903PWG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features RF and baseband circuits, with a supply voltage of 2.7V and max current of 0.042mA. This small outline package is ideal for telecom applications requiring compact design and low power consumption.
TRF370317IRGETG4
TRF370317IRGETG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features a supply voltage of 5V, RF and baseband circuit for telecom applications, and a compact square package style suitable for industrial use.
CC115LRTKT
CC115LRTKT by Texas Instruments is a cellphone IC with a package style of chip carrier, suitable for RF and baseband circuits. It operates in industrial temperature range (-40 to 85°C) with a nominal voltage of 3.6V. This surface-mount device has 20 terminals, nickel palladium gold finish, and compact dimensions (4x4mm).
AD6673BCPZ-250
Analog Devices
AD6673BCPZ-250 by Analog Devices is a cellphone IC with 48 terminals, operating at -40 to 85°C. It has a supply voltage of 1.8V and consumes 0.282mA max current. Ideal for baseband circuits in telecom applications due to its CMOS technology and compact square package design with a low profile of 0.8mm.
HMC687LP4TR
Analog Devices' HMC687LP4TR is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. Operating temperature range from -40 to 85 °C, suitable for RF and baseband circuits in telecom applications. Package style includes heat sink/slug, very thin profile, ideal for compact designs.
NRF24L01-REEL7
NRF24L01-REEL7 by Nordic Semiconductor Asa is a cellphone IC with 20 terminals, operating from -40 to 85°C. It features a square package shape, matte tin finish, and RF/baseband circuit type. Ideal for industrial applications due to its low profile and no lead terminal form.
HMC683LP6C
Analog Devices' HMC683LP6C is a 40-terminal cellphone IC in a square chip carrier package with tin/lead finish. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
HMC601LP4ETR
Analog Devices' HMC601LP4ETR is a 24-terminal cellphone IC in a square chip carrier package with matte tin finish. Operating temperature range from -40 to 85 °C, suitable for industrial telecom applications. Features RF front end circuit, 3.3V supply voltage, and compact dimensions of 4x4mm for space-constrained designs.
LMH2110TM/NOPB
LMH2110TM/NOPB by Texas Instruments is a Cellphone IC with 6 terminals in a rectangular grid array package. It operates b/w -40 to 85°C, with a supply current of 5.5mA at 4.5V. This RF and baseband circuit is ideal for telecom applications due to its thin profile and fine pitch design.
TCM8000AFN
BASEBAND CIRCUIT;
AT86RF233-ZUR
Microchip Technology
AT86RF233-ZUR by Microchip Technology is a cellphone IC with 32 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 3V, CMOS technology, and RF/baseband circuitry. This surface-mount chip carrier has a compact square shape ideal for telecom applications.
CC1110F8RSP
CC1110F8RSP by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 85°C, making it suitable for industrial applications. This RF and baseband circuit has a nominal voltage of 3V and terminal pitch of 0.5mm, ideal for telecom devices.
CC1000-RTR2
CC1000-RTR2 by Texas Instruments is a cellphone IC with 28 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 3V, CMOS technology, and RF/baseband circuitry. This rectangular package has a very thin profile, fine pitch grid array style for surface mounting applications.
LMV226TL/NOPB
LMV226TL/NOPB by Texas Instruments is a cellphone IC with surface mount capability. It features a max operating temperature of 85°C, min operating temperature of -40°C, and max supply current of 8mA. Ideal for telecom applications requiring RF and baseband circuit integration in industrial-grade environments.
ADRF6601ACPZ-R7
Analog Devices' ADRF6601ACPZ-R7 is a 40-terminal cellphone IC with BICMOS technology. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
CC1110F16RSP
The Texas Instruments CC1110F16RSP is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. This RF and baseband circuit has a terminal pitch of 0.5mm and is suitable for industrial applications.
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TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
TRF370317IRGER
TRF370317IRGER by Texas Instruments is a cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 5V and max current of 0.245mA. Ideal for RF and baseband circuits in industrial telecom applications.
TRF370317IRGET
TRF370317IRGET by Texas Instruments is a cellphone IC with 24 terminals in a square chip carrier package. It operates at -40 to 85°C, with a supply voltage of 5V and max current of 0.245mA. Ideal for RF and baseband circuits, it features nickel palladium gold finish and no-lead terminal form.
TRF3710IRGZT
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
TRF370317IRGERG4
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
TRF370315IRGET
TRF3701IRHCR
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
TRF3040PHP
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
TRF3701CRHC
RF AND BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
TRF3702IRHC
TRF3702IRHCG4
TRF3701IRHCG4
TRF3701CRHCR
TRF3702IRHCR
TRF3040PTR
TRF3702IRHCRG4
TRF3701IRHCRG4
TRF3040
TRF3040PT
TRF3701IRHC
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