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TRF1015DBLE

Texas Instruments

TRF1015DBLE by Texas Instruments

TRF1015DBLE by Texas Instruments is a cellphone IC with 20 terminals, operating temp. range of -40 to 85°C, and supply voltage of 3.75V. It's a RF front end circuit in small outline package suitable for telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,950 parts In-Stock

1+ parts

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4,950

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Vyrian

USA . 2,595 parts In-Stock

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2,595

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Distributors (Availability)

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AZTECH Wire

Italy . 719 parts In-Stock

1+ parts

$9.985

100+ parts

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719

$9.985

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Parana Technologies

USA . 1,347 parts In-Stock

1+ parts

$15.799

100+ parts

-

1k+ parts

$16.156

10k+ parts

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1,347

$15.799

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$16.156

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DigiPath Technology Company

USA . 1,315 parts In-Stock

1+ parts

$17.397

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1,315

$17.397

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ChromeModa Solutions

Germany . 4,999 parts In-Stock

1+ parts

$17.752

100+ parts

$14.557

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4,999

$17.752

$14.557

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IDEA Electronic Components Group

UK . 1,776 parts In-Stock

1+ parts

$17.752

100+ parts

$16.864

1k+ parts

$15.977

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1,776

$17.752

$16.864

$15.977

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One Stop Electronics

USA . 1,412 parts In-Stock

1+ parts

$40.000

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1,412

$40.000

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Semicontronic

India . 1,626 parts In-Stock

1+ parts

$422.000

100+ parts

$411.450

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$409.340

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1,626

$422.000

$411.450

$409.340

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Corphita

USA . 2,431 parts In-Stock

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2,431

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Corohmni

South Africa . 240 parts In-Stock

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240

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Overview

Enhance the performance of your cellphone with the TRF1015DBLE by Texas Instruments. Known for their top-notch quality and innovation in the industry, Texas Instruments delivers a cutting-edge RF front end circuit that will take your mobile experience to the next level. Whether you're looking for improved signal reception or enhanced data transmission, this small outline package offers outstanding value and reliability. Upgrade your device today with the TRF1015DBLE and enjoy seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and heat resistance, making the product suitable for various environmental conditions.

Surface Mount: YES

Surface mount feature allows for easy installation and integration into circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact design, saving space on the circuit board and allowing for more efficient placement of components.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and functionalities, making the product versatile and suitable for complex circuit designs.

Package Style: SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style ensures high density integration, reducing signal interference and optimizing performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in extreme heat conditions, making the product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to function in cold environments without compromising performance, ensuring versatility in usage.

Terminal Position: DUAL

Dual terminal position enables efficient connectivity and reduces signal loss, enhancing the overall performance of the product.

Maximum Seated Height: 2 mm

Low maximum seated height provides a slim profile, allowing for compact design and efficient use of space on the circuit board.

Width: 5.3 mm

Narrow width dimension allows for easy placement and positioning on the circuit board, enabling seamless integration into various electronic devices.

Length: 7.2 mm

Compact length dimension saves space and allows for flexible placement options, enhancing the versatility of the product in different applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments, making the product a durable and robust choice for demanding applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and easy soldering, enhancing the overall reliability and longevity of the product.

Telecom IC Type: RF FRONT END CIRCUIT

RF front end circuit type enables wireless communication capabilities, making the product ideal for cellphone applications requiring high-speed data transmission.

Nominal Supply Voltage: 3.75 V

Stable nominal supply voltage ensures consistent performance and reliability, making the product suitable for demanding electronic applications.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density integration and precise connections, optimizing signal transfer and overall performance of the product.

Technical Specifications

Cellphone ICs TRF1015DBLE attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Length:

7.2 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Nominal Supply Voltage:

3.75 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

TRF1015DBLE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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