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MAX5864E/D

Analog Devices

MAX5864E/D by Analog Devices

Analog Devices' MAX5864E/D is a cellphone IC with CMOS technology, operating from -40 to 85 °C. It features an unencased chip package, tin-lead terminal finish, and 3V supply voltage. Ideal for RF and baseband circuits in industrial-grade telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,418 parts In-Stock

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Digiode

USA . 1,981 parts In-Stock

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Anansix

USA . 1,103 parts In-Stock

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AZTECH Wire

Italy . 857 parts In-Stock

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$6.542

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MARBEL Systems

Belgium . 4,178 parts In-Stock

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$14.456

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Texas Native Microelectronics

USA . 5,336 parts In-Stock

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$16.616

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$15.453

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$14.622

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Kenton Components

USA . 37 parts In-Stock

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$19.939

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$17.546

37

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Qasali Group International

UK . 1,230 parts In-Stock

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$44.863

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One Stop Electronics

USA . 2,586 parts In-Stock

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$319.000

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Semicontronic

India . 666 parts In-Stock

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$754.000

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$735.150

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$731.380

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Corphita

USA . 1,905 parts In-Stock

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Overview

Unlock the potential of your cellphone with the MAX5864E/D by Analog Devices. Designed with precision and innovation, Analog Devices is a trusted manufacturer known for delivering high-quality products. This Cellphone IC offers seamless integration, enhanced performance, and improved efficiency. From RF to baseband circuitry, this versatile IC ensures optimal functionality in various telecom applications. Experience superior quality and reliability with the MAX5864E/D, a game-changer in the world of mobile technology. Elevate your device's capabilities with Analog Devices' cutting-edge technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing manufacturing costs.

Package Style (Meter): UNCASED CHIP

The unencased chip package style provides flexibility for customization and integration into various cellphone designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and ensure stable performance under heat.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature makes this IC suitable for use in different climates and environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers good solderability and electrical conductivity, ensuring reliable connections in the circuit.

Terminal Position: UPPER

Upper terminal position simplifies the PCB layout and routing, making it easier for design and assembly processes.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures stable performance in demanding industrial applications where temperature fluctuations are common.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of operating voltages, making the IC energy-efficient and versatile.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations such as RoHS and offers improved thermal conductivity for better heat dissipation.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuits in one IC simplifies the design of cellphone systems, enhances signal processing capabilities, and improves overall performance.

Nominal Supply Voltage: 3 V

Operating at a 3V nominal supply voltage, this IC is compatible with standard power sources in cellphones, ensuring efficient power management and stable operation.

Technical Specifications

Cellphone ICs MAX5864E/D attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

X-XUUC-N

JESD-609 Code:

e0

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

MAX5864E/D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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