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CC1110F32RSP

Texas Instruments

CC1110F32RSP by Texas Instruments

CC1110F32RSP by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 3V, making it ideal for telecom applications.

Median Price

$3.440

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 880 parts In-Stock

1+ parts

-

100+ parts

$3.440

1k+ parts

$3.080

10k+ parts

$2.900

880

-

$3.440

$3.080

$2.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,681 parts In-Stock

1+ parts

$3.629

100+ parts

-

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-

10k+ parts

-

3,681

$3.629

-

-

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Vyrian

USA . 8,550 parts In-Stock

1+ parts

-

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8,550

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A&K Electronics

USA . 2,542 parts In-Stock

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2,542

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Rotakorn

Sweden . 2,542 parts In-Stock

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2,542

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Bristol Electronics

USA . 2,542 parts In-Stock

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2,542

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Martec Srl

Italy . 592 parts In-Stock

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592

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EMSNET

USA . 200 parts In-Stock

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200

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

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100

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Sensible Micro Corp

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$6.523

1k+ parts

$6.021

10k+ parts

-

2

-

$6.523

$6.021

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 708 parts In-Stock

1+ parts

$3.250

100+ parts

-

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-

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708

$3.250

-

-

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Semicontronic

India . 504 parts In-Stock

1+ parts

$3.250

100+ parts

$3.169

1k+ parts

$3.152

10k+ parts

-

504

$3.250

$3.169

$3.152

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Corphita

USA . 3,882 parts In-Stock

1+ parts

$3.438

100+ parts

-

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3,882

$3.438

-

-

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Parana Technologies

USA . 766 parts In-Stock

1+ parts

$5.736

100+ parts

$532.679

1k+ parts

$5.162

10k+ parts

-

766

$5.736

$532.679

$5.162

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DigiPath Technology Company

USA . 1,589 parts In-Stock

1+ parts

$6.316

100+ parts

$5.811

1k+ parts

-

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1,589

$6.316

$5.811

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ChromeModa Solutions

Germany . 6,590 parts In-Stock

1+ parts

$6.445

100+ parts

$5.285

1k+ parts

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6,590

$6.445

$5.285

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IDEA Electronic Components Group

UK . 1,854 parts In-Stock

1+ parts

$6.445

100+ parts

-

1k+ parts

$5.800

10k+ parts

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1,854

$6.445

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$5.800

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Aztec Data Supply Inc.

USA . 6,033 parts In-Stock

1+ parts

$6.830

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6,033

$6.830

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AZTECH Wire

Italy . 664 parts In-Stock

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$13.554

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664

$13.554

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Corohmni

South Africa . 467 parts In-Stock

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$14.279

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467

$14.279

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Lixinc

USA . 18,373 parts In-Stock

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18,373

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A-Z Elektronik GmbH

Germany . 7,143 parts In-Stock

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7,143

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Kepictronics

USA . 6,854 parts In-Stock

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6,854

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Alle Elektronik GmbH

Germany . 4,762 parts In-Stock

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4,762

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Continental Prestige Electronics

USA . 1,704 parts In-Stock

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Argo Parts USA

USA . 1,535 parts In-Stock

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1,535

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 663 parts In-Stock

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663

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Overview

Unleash the power of cutting-edge technology with the CC1110F32RSP by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality Cellphone ICs that are designed to exceed expectations. Whether you're looking to enhance your mobile device's performance or develop innovative communication solutions, this product is the perfect choice. With advanced features and unmatched reliability, the CC1110F32RSP provides exceptional value and benefits to customers. Elevate your projects with this versatile and high-performance IC today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a PCB, saving valuable time and labor costs.

Power Supplies (V): 3

A low voltage of 3V ensures efficient power consumption and compatibility with various devices and applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink, and very thin profile design allows for compact and efficient integration of the IC into devices with limited space.

Maximum Operating Temperature: 85°C

The high maximum operating temperature of 85°C ensures reliability and performance in a wide range of environmental conditions.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product can withstand multiple reflows and has good moisture resistance, ensuring long-term reliability in manufacturing and operation.

Technical Specifications

Cellphone ICs CC1110F32RSP attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

CC1110F32RSP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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