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AD8340ACP

Analog Devices

AD8340ACP by Analog Devices

AD8340ACP by Analog Devices is a cellphone IC with 24 terminals in a square package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It features RF and baseband circuits, operates at 5V supply voltage, and has a terminal pitch of 0.5mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,716 parts In-Stock

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3,716

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Digiode

USA . 119 parts In-Stock

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119

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Parana Technologies

USA . 3,709 parts In-Stock

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$8.950

100+ parts

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$8.324

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3,709

$8.950

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$8.324

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IDEA Electronic Components Group

UK . 1,295 parts In-Stock

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$9.624

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$9.143

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$9.624

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DigiPath Technology Company

USA . 306 parts In-Stock

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$15.013

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$14.413

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$14.413

306

$15.013

$14.413

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$14.413

AZTECH Wire

Italy . 579 parts In-Stock

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$18.194

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579

$18.194

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One Stop Electronics

USA . 524 parts In-Stock

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$209.000

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524

$209.000

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Ampacity Inc.

Singapore . 135 parts In-Stock

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$567.000

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135

$567.000

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Semicontronic

India . 522 parts In-Stock

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$786.000

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$766.350

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$762.420

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522

$786.000

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Northwest PG Solutions

USA . 1,208 parts In-Stock

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Native Components

USA . 915 parts In-Stock

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Corphita

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Overview

Enhance your cellphone's performance with the AD8340ACP by Analog Devices, a top-quality RF and baseband circuit IC designed to optimize signal transmission. With Analog Devices' reputation for excellence in technology, trust that this product delivers superior results. From improved connectivity to enhanced call quality, this versatile component is a game-changer for mobile devices. Say goodbye to dropped calls and slow data speeds - upgrade to the AD8340ACP and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Package Shape: SQUARE

Square package shape helps in optimizing space on the circuit board and allows for efficient heat dissipation.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of systems and power sources.

No. of Terminals: 24

Having 24 terminals provides a high level of connectivity and functionality within the integrated circuit.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can perform reliably under harsh environmental conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish ensures good electrical conductivity and solderability for secure connections.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and precise control, making this IC suitable for demanding applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and simplifies system design.

Technical Specifications

Cellphone ICs AD8340ACP attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e0

Length:

4 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

AD8340ACP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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