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MAX2550ETN+

Analog Devices

MAX2550ETN+ by Analog Devices

Analog Devices' MAX2550ETN+ is a cellphone IC with 56 terminals in a square chip carrier package. Operating b/w -40 °C to 85°C, it has a supply voltage of 3.3V and max current of 390mA. Ideal for RF and baseband circuits, this IC features a terminal pitch of 0.4mm and is suitable for industrial temperature grade applications.

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1k+

MAX2550ETN+ by Analog Devices
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Vyrian

USA . 3,790 parts In-Stock

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Digiode

USA . 1,737 parts In-Stock

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Anansix

USA . 1,327 parts In-Stock

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AZTECH Wire

Italy . 217 parts In-Stock

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$13.721

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MARBEL Systems

Belgium . 4,378 parts In-Stock

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$14.916

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Texas Native Microelectronics

USA . 4,768 parts In-Stock

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$17.145

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$15.945

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$15.088

4,768

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$15.088

Kenton Components

USA . 4,740 parts In-Stock

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$20.574

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$18.105

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Qasali Group International

UK . 562 parts In-Stock

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$46.292

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One Stop Electronics

USA . 2,380 parts In-Stock

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$49.000

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Semicontronic

India . 436 parts In-Stock

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$138.000

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$134.550

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$133.860

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Corphita

USA . 1,031 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

USA . 475 parts In-Stock

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Overview

Upgrade your cellphone technology with the MAX2550ETN+ by Analog Devices. Designed with precision and quality in mind, this cellphone IC offers unmatched performance and reliability. From its surface mount capability to its industrial temperature grade, this product is a game-changer in the telecom industry. With features like a nominal supply voltage of 3.3V and maximum supply current of 390mA, the MAX2550ETN+ provides exceptional value for customers looking to enhance their mobile devices. Experience the advantages of Analog Devices' superior engineering and innovation with the MAX2550ETN+.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for mass production.

Package Shape: SQUARE

The square shape of the package provides a compact and space-saving design, ideal for small electronic devices.

No. of Terminals: 56

With a high number of terminals, this IC offers extensive connectivity options for complex circuit designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and stability under tough environmental conditions.

Nominal Supply Voltage: 3.3 V

The 3.3V supply voltage is a common standard in electronics, making integration with other components easier.

Technical Specifications

Cellphone ICs MAX2550ETN+ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N56

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC56,.30SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Current:

390 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

MAX2550ETN+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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