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CC1110F16RSPR

Texas Instruments

CC1110F16RSPR by Texas Instruments

The Texas Instruments CC1110F16RSPR is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. This RF and baseband circuit has a terminal pitch of 0.5mm and is suitable for industrial temperature grade applications.

Median Price

$3.087

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$2.760

1k+ parts

$2.470

10k+ parts

$2.330

2,500

-

$2.760

$2.470

$2.330

DigiKey

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$3.190

1k+ parts

-

10k+ parts

-

2,500

-

$3.190

-

-

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.087

10k+ parts

$2.913

2,500

-

-

$3.087

$2.913

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,098 parts In-Stock

1+ parts

$2.916

100+ parts

-

1k+ parts

-

10k+ parts

-

2,098

$2.916

-

-

-

Vyrian

USA . 4,926 parts In-Stock

1+ parts

$3.070

100+ parts

-

1k+ parts

-

10k+ parts

-

4,926

$3.070

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 239 parts In-Stock

1+ parts

$1.595

100+ parts

-

1k+ parts

-

10k+ parts

-

239

$1.595

-

-

-

Northwest PG Solutions

USA . 1,871 parts In-Stock

1+ parts

$1.755

100+ parts

-

1k+ parts

-

10k+ parts

-

1,871

$1.755

-

-

-

Corphita

USA . 1,427 parts In-Stock

1+ parts

$2.763

100+ parts

-

1k+ parts

-

10k+ parts

-

1,427

$2.763

-

-

-

Parana Technologies

USA . 131 parts In-Stock

1+ parts

$8.423

100+ parts

-

1k+ parts

$9.062

10k+ parts

-

131

$8.423

-

$9.062

-

DigiPath Technology Company

USA . 1,950 parts In-Stock

1+ parts

$9.275

100+ parts

$8.533

1k+ parts

-

10k+ parts

-

1,950

$9.275

$8.533

-

-

ChromeModa Solutions

Germany . 6,429 parts In-Stock

1+ parts

$9.464

100+ parts

$7.760

1k+ parts

-

10k+ parts

-

6,429

$9.464

$7.760

-

-

IDEA Electronic Components Group

UK . 1,603 parts In-Stock

1+ parts

$9.464

100+ parts

$8.991

1k+ parts

$8.518

10k+ parts

-

1,603

$9.464

$8.991

$8.518

-

Kepictronics

USA . 50,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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50,000

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-

-

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Lixinc

USA . 13,230 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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13,230

-

-

-

-

Overview

Upgrade your cellphone's performance with the CC1110F16RSPR by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-notch quality in every product. This Cellphone IC is designed for seamless integration and optimal performance, making it an essential component for your device. With its advanced technology and industrial-grade temperature tolerance, this IC ensures reliability and efficiency. Experience the benefits of enhanced connectivity and functionality with the CC1110F16RSPR, providing value and peace of mind to customers.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Package Shape: SQUARE

Square package shape provides stability and efficient use of space on the circuit board.

Power Supplies (V): 3

Operates at a standard voltage of 3V, making it compatible with a wide range of devices and power sources.

No. of Terminals: 36

Provides a high level of connectivity options for integration with various components in the device.

Maximum Operating Temperature: 85 °C

Capable of withstanding high temperatures, ensuring reliability and performance in demanding operating conditions.

Minimum Operating Temperature: -40 °C

Able to function in extreme cold environments, making it suitable for use in a variety of climates.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity, corrosion resistance, and solderability for long-lasting performance.

Technology: CMOS

Utilizes CMOS technology for low power consumption, high speed, and compatibility with modern electronic systems.

Nominal Supply Voltage: 3 V

Operates at a standard voltage of 3V, ensuring compatibility with typical power sources and devices.

Technical Specifications

Cellphone ICs CC1110F16RSPR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

CC1110F16RSPR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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