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TCM320AC56DW

Texas Instruments

TCM320AC56DW by Texas Instruments

Texas Instruments TCM320AC56DW is a Cellphone IC with 20 terminals, operating from -40 to 85°C. It features Gull Wing terminals, 5V supply voltage, and is ideal for Baseband Circuit applications in the telecom industry.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,209 parts In-Stock

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Digiode

USA . 4,796 parts In-Stock

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4,796

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 869 parts In-Stock

1+ parts

$12.169

100+ parts

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869

$12.169

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Parana Technologies

USA . 277 parts In-Stock

1+ parts

$14.342

100+ parts

-

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$14.791

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277

$14.342

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$14.791

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DigiPath Technology Company

USA . 162 parts In-Stock

1+ parts

$15.793

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162

$15.793

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ChromeModa Solutions

Germany . 5,479 parts In-Stock

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$16.115

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$13.214

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5,479

$16.115

$13.214

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IDEA Electronic Components Group

UK . 2,244 parts In-Stock

1+ parts

$16.115

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$15.309

1k+ parts

$14.504

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2,244

$16.115

$15.309

$14.504

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One Stop Electronics

USA . 1,256 parts In-Stock

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$679.000

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1,256

$679.000

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Corphita

USA . 4,606 parts In-Stock

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Overview

Discover the cutting-edge technology of the TCM320AC56DW by Texas Instruments, a leading manufacturer known for their high-quality cellphone ICs. This versatile product offers endless possibilities in telecommunications applications, providing customers with exceptional value and performance. With its compact design, wide operating temperature range, and industrial-grade quality, this baseband circuit is sure to exceed your expectations. Upgrade your communication systems today with the TCM320AC56DW and experience the unparalleled benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product suitable for mobile devices that require portability.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during production.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options and flexibility for various functions and features in the cellphone IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can reliably function even under demanding conditions, ensuring consistent performance.

Width: 7.5 mm

The compact width of 7.5mm allows for space-efficient design and integration into slim mobile devices.

Telecom IC Type: BASEBAND CIRCUIT

Being a baseband circuit IC, it is crucial for processing communication signals, ensuring reliable and efficient data transmission in the cellphone.

Technical Specifications

Cellphone ICs TCM320AC56DW attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TCM320AC56DW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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