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HMC686LP4ETR

Analog Devices

HMC686LP4ETR by Analog Devices

HMC686LP4ETR by Analog Devices is a Cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,717 parts In-Stock

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Chip Stock

USA . 3,040 parts In-Stock

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3,040

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Digiode

USA . 338 parts In-Stock

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338

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Distributors (Availability)

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Parana Technologies

USA . 17 parts In-Stock

1+ parts

$8.620

100+ parts

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$8.017

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17

$8.620

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$8.017

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IDEA Electronic Components Group

UK . 134 parts In-Stock

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$9.269

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$8.806

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134

$9.269

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$8.806

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AZTECH Wire

Italy . 699 parts In-Stock

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$12.914

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699

$12.914

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DigiPath Technology Company

USA . 1,415 parts In-Stock

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$14.460

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$13.881

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$13.881

1,415

$14.460

$13.881

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$13.881

Ampacity Inc.

Singapore . 400 parts In-Stock

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$339.000

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400

$339.000

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Semicontronic

India . 779 parts In-Stock

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$413.000

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$402.675

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$400.610

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779

$413.000

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$400.610

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One Stop Electronics

USA . 509 parts In-Stock

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$442.000

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509

$442.000

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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RC Electronics

USA . 5,975 parts In-Stock

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$5.500

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$4.990

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$4.810

5,975

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$5.500

$4.990

$4.810

A-Z Elektronik GmbH

Germany . 2,283 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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Corphita

USA . 203 parts In-Stock

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203

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Overview

Upgrade your cellphone performance with the HMC686LP4ETR by Analog Devices. Known for their outstanding quality and reliability, Analog Devices delivers cutting-edge technology in the form of this Cellphone ICs. With a package style of CHIP CARRIER, HEAT SINK/SLUG, and VERY THIN PROFILE, this product offers unparalleled value and benefits to customers. Whether you're looking to enhance your phone's RF and baseband circuit or improve overall efficiency, the HMC686LP4ETR is the perfect solution. Elevate your mobile experience today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight, durable, and cost-effective, making it a good choice for cellphone ICs.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, increasing efficiency in manufacturing.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand demanding thermal conditions, ensuring reliability.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high-speed performance and low power consumption.

Nominal Supply Voltage: 5 V

Operating at a standard 5V supply voltage simplifies system design and compatibility with other components.

Technical Specifications

Cellphone ICs HMC686LP4ETR attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

HMC686LP4ETR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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