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CC1260RGZT

Texas Instruments

CC1260RGZT by Texas Instruments

CC1260RGZT by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40°C to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.

Median Price

$8.150

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 258 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.150

10k+ parts

$7.600

258

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-

$8.150

$7.600

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,882 parts In-Stock

1+ parts

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4,882

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Vyrian

USA . 4,409 parts In-Stock

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4,409

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 944 parts In-Stock

1+ parts

$0.151

100+ parts

-

1k+ parts

-

10k+ parts

$0.145

944

$0.151

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-

$0.145

Northwest PG Solutions

USA . 268 parts In-Stock

1+ parts

$0.166

100+ parts

-

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$0.146

268

$0.166

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$0.146

Parana Technologies

USA . 33 parts In-Stock

1+ parts

$15.175

100+ parts

-

1k+ parts

$15.575

10k+ parts

-

33

$15.175

-

$15.575

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DigiPath Technology Company

USA . 2,116 parts In-Stock

1+ parts

$16.710

100+ parts

$15.373

1k+ parts

-

10k+ parts

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2,116

$16.710

$15.373

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ChromeModa Solutions

Germany . 2,024 parts In-Stock

1+ parts

$17.051

100+ parts

$13.982

1k+ parts

-

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2,024

$17.051

$13.982

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IDEA Electronic Components Group

UK . 1,100 parts In-Stock

1+ parts

$17.051

100+ parts

$16.198

1k+ parts

$15.346

10k+ parts

-

1,100

$17.051

$16.198

$15.346

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Corphita

USA . 3,423 parts In-Stock

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3,423

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Overview

Elevate your cellphone's performance with the CC1260RGZT by Texas Instruments. Known for their top-notch quality and innovation, Texas Instruments delivers cutting-edge Cellphone ICs like no other. This versatile component boasts a myriad of applications, ensuring optimal functionality and efficiency for your device. With its compact size, durable build, and advanced features, the CC1260RGZT offers customers unparalleled value, benefits, and advantages. Upgrade your cellphone experience today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product suitable for portable devices like cellphones.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the integrated circuit onto the PCB, saving time and making the product more cost-effective.

Package Shape: SQUARE

Square package shape is efficient for space utilization on the PCB and helps in compact design of the cellphone.

No. of Terminals: 48

Having 48 terminals allows for a higher level of connectivity and functionality in the cellphone IC, enabling it to perform a wide range of tasks.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile style helps in efficient heat dissipation, compact design, and overall improved performance of the IC in the cellphone.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures that the IC can withstand heat stress under various operating conditions, enhancing its reliability and longevity.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to function in cold environments without any performance issues, making it suitable for use in diverse conditions.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of multiple finishes on terminals enhances conductivity, corrosion resistance, and overall performance of the IC, ensuring long-term reliability and signal integrity.

Terminal Position: QUAD

Quad terminal position allows for efficient placement on the PCB and enables better signal routing, enhancing overall performance and reliability of the IC in the cellphone.

Maximum Seated Height: 1 mm

The low seated height helps in slim design of the cellphone, enabling sleek and compact form factor while maintaining high functionality.

Width: 7 mm

The compact width of 7 mm allows for efficient use of space on the PCB, enabling the design of slim and sleek cellphones without compromising on functionality.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature indicates quick and efficient soldering process during assembly, ensuring high quality and reliability of the IC in the cellphone.

Peak Reflow Temperature °C: 260

High peak reflow temperature helps in proper bonding of the IC to the PCB during assembly, ensuring strong connections and reliable performance of the cellphone IC.

Length: 7 mm

The compact length of 7 mm allows for space-efficient design on the PCB, enabling the integration of the IC in small form factor cellphones without compromising on performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance of the IC in harsh operating conditions, making it suitable for use in industrial settings where temperature variations are common.

Terminal Form: NO LEAD

Lead-free terminal form is environmentally friendly and compliant with regulations, making the product a sustainable choice for cellphone manufacturers.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Inclusion of RF and baseband circuit in the IC makes it suitable for handling wireless communication signals in the cellphone, ensuring seamless connectivity and high-quality network performance.

Nominal Supply Voltage: 3.3 V

Stable supply voltage of 3.3V ensures consistent and reliable operation of the IC in the cellphone, preventing voltage fluctuations and potential damage to the circuit.

Terminal Pitch: 0.5 mm

Narrow terminal pitch of 0.5 mm allows for high density integration of components on the PCB, enabling the design of advanced and feature-rich cellphones with compact form factor.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, ensuring that the IC can withstand moderate exposure to humidity during storage and assembly, making it suitable for a wide range of environmental conditions.

Technical Specifications

Cellphone ICs CC1260RGZT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

CC1260RGZT Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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