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TRF370333IRGETG4

Texas Instruments

TRF370333IRGETG4 by Texas Instruments

TRF370333IRGETG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features a supply voltage of 5V, RF and baseband circuit for telecom applications, and a compact square package suitable for surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,441 parts In-Stock

1+ parts

-

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7,441

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Digiode

USA . 3,076 parts In-Stock

1+ parts

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3,076

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,196 parts In-Stock

1+ parts

$6.831

100+ parts

-

1k+ parts

$7.465

10k+ parts

-

2,196

$6.831

-

$7.465

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DigiPath Technology Company

USA . 947 parts In-Stock

1+ parts

$7.522

100+ parts

$6.920

1k+ parts

-

10k+ parts

-

947

$7.522

$6.920

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ChromeModa Solutions

Germany . 1,679 parts In-Stock

1+ parts

$7.675

100+ parts

$6.294

1k+ parts

-

10k+ parts

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1,679

$7.675

$6.294

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IDEA Electronic Components Group

UK . 866 parts In-Stock

1+ parts

$7.675

100+ parts

-

1k+ parts

$6.908

10k+ parts

-

866

$7.675

-

$6.908

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AZTECH Wire

Italy . 381 parts In-Stock

1+ parts

$8.256

100+ parts

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381

$8.256

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One Stop Electronics

USA . 1,288 parts In-Stock

1+ parts

$409.000

100+ parts

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1,288

$409.000

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Corphita

USA . 2,947 parts In-Stock

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2,947

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Overview

Enhance the performance of your cellphone with the TRF370333IRGETG4 by Texas Instruments. Known for their top-notch quality and expertise, Texas Instruments delivers cutting-edge Cellphone ICs that are designed to optimize efficiency and functionality. This innovative product offers customers unparalleled value and benefits, ensuring a seamless user experience. Whether you're looking to improve signal strength, enhance connectivity, or boost overall performance, the TRF370333IRGETG4 is the perfect solution for all your cellphone needs. Trust Texas Instruments to provide reliable, high-quality components that are guaranteed to exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable design, ideal for portable devices like cellphones.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving time and effort during production.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even under high temperature conditions, making the product suitable for various environments.

Nominal Supply Voltage: 5 V

Common voltage requirement in many electronic devices, allowing for compatibility and ease of integration.

Terminal Position: QUAD

Quad terminal position provides additional stability and connectivity for the component on the circuit board.

Moisture Sensitivity Level (MSL): 2

Indicates the level of protection against moisture, ensuring the longevity and reliability of the product.

Technical Specifications

Cellphone ICs TRF370333IRGETG4 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.235 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Trade Compliance

TRF370333IRGETG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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