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HMC689LP4E

Analog Devices

HMC689LP4E by Analog Devices

Analog Devices' HMC689LP4E is a 24-terminal cellphone IC in a square chip carrier package with matte tin finish. Operating temperature range from -40 to 85°C, suitable for industrial telecom applications. Utilizes BiCMOS technology with 5V supply voltage and RF/baseband circuit integration.

Median Price

$12.240

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 435 parts In-Stock

1+ parts

$12.240

100+ parts

$12.000

1k+ parts

$11.750

10k+ parts

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435

$12.240

$12.000

$11.750

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 199 parts In-Stock

1+ parts

$11.628

100+ parts

-

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199

$11.628

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Vyrian

USA . 7,758 parts In-Stock

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7,758

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 4,372 parts In-Stock

1+ parts

$5.640

100+ parts

-

1k+ parts

$5.246

10k+ parts

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4,372

$5.640

-

$5.246

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IDEA Electronic Components Group

UK . 2,022 parts In-Stock

1+ parts

$6.065

100+ parts

-

1k+ parts

$5.762

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2,022

$6.065

-

$5.762

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DigiPath Technology Company

USA . 673 parts In-Stock

1+ parts

$9.461

100+ parts

$9.083

1k+ parts

-

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673

$9.461

$9.083

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Semicontronic

India . 43 parts In-Stock

1+ parts

$10.400

100+ parts

$10.140

1k+ parts

$10.088

10k+ parts

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43

$10.400

$10.140

$10.088

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Corphita

USA . 655 parts In-Stock

1+ parts

$11.016

100+ parts

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655

$11.016

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Advanced Electronics

New Zealand . 56 parts In-Stock

1+ parts

$17.621

100+ parts

$16.035

1k+ parts

$14.449

10k+ parts

-

56

$17.621

$16.035

$14.449

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QUARKTWIN TECHNOLOGY LTD

USA . 27,431 parts In-Stock

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27,431

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Metaverse IC Inc.

Canada . 5,880 parts In-Stock

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5,880

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Perfect Parts

USA . 95 parts In-Stock

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95

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Overview

Upgrade your cellphone performance with the HMC689LP4E by Analog Devices. Renowned for their quality and reliability, Analog Devices offers cutting-edge Cellphone ICs that provide seamless integration and enhanced functionality. This chip carrier boasts a very thin profile, matte tin terminal finish, and industrial-grade temperature resilience, making it ideal for telecom applications requiring RF and baseband circuits. With a nominal supply voltage of 5V, this IC ensures optimal performance and efficiency for your mobile devices. Elevate your technology with Analog Devices' HMC689LP4E and experience the difference in quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the cellphone ICs ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy installation and efficient use of space on the circuit board.

Package Shape: SQUARE

The square shape of the package helps in efficient placement and orientation on the circuit board.

No. of Terminals: 24

Having 24 terminals allows for multiple connections and functionalities within the IC.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even under demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the IC can function in a wide range of environments.

Terminal Finish: MATTE TIN

MATTE TIN terminal finish provides good conductivity and solderability for reliable connections.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of connections on the circuit board.

Maximum Seated Height: 1 mm

The low maximum seated height helps in designing slim and compact devices.

Width: 4 mm

The compact width of the IC makes it suitable for small electronic devices.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and reliability during assembly.

Temperature Grade: INDUSTRIAL

Being industrial-grade, the IC can withstand harsh operating conditions in various applications.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is commonly used in electronics, making the IC compatible with standard power sources.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for compact design and high-density integration on the circuit board.

Technical Specifications

Cellphone ICs HMC689LP4E attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

HMC689LP4E Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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