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HMC601LP4

Analog Devices

HMC601LP4 by Analog Devices

Analog Devices' HMC601LP4 is a 24-terminal cellphone IC in a square chip carrier package with a very thin profile. It operates b/w -40 to 85°C, suitable for industrial use. This RF front end circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,962 parts In-Stock

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6,962

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Digiode

USA . 920 parts In-Stock

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920

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 3,898 parts In-Stock

1+ parts

$8.643

100+ parts

-

1k+ parts

$8.038

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3,898

$8.643

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$8.038

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IDEA Electronic Components Group

UK . 874 parts In-Stock

1+ parts

$9.294

100+ parts

-

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$8.829

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874

$9.294

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$8.829

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DigiPath Technology Company

USA . 553 parts In-Stock

1+ parts

$14.499

100+ parts

$13.919

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-

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$13.919

553

$14.499

$13.919

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$13.919

AZTECH Wire

Italy . 572 parts In-Stock

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$16.622

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572

$16.622

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One Stop Electronics

USA . 760 parts In-Stock

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$551.000

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760

$551.000

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Semicontronic

India . 1,287 parts In-Stock

1+ parts

$966.000

100+ parts

$941.850

1k+ parts

$937.020

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1,287

$966.000

$941.850

$937.020

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Corphita

USA . 46 parts In-Stock

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Overview

Enhance the performance of your cellphone with the HMC601LP4 by Analog Devices. Known for their superior quality and cutting-edge technology, Analog Devices delivers top-of-the-line Cellphone ICs that are designed to optimize efficiency and reliability. The HMC601LP4 is a game-changer in the telecom industry, offering unparalleled functionality and seamless integration. Upgrade your device today and experience the difference with Analog Devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the cellphone ICs from external elements, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and secure mounting on the PCB, making installation process more efficient.

No. of Terminals: 24

Offers sufficient connections for various functions and features in the cellphone ICs, enabling versatility in its usage.

Temperature Grade: INDUSTRIAL

Withstanding industrial temperature ranges ensures reliable performance in harsh environments, making it suitable for industrial applications.

Nominal Supply Voltage: 3.3 V

Operates efficiently at a standard voltage level, ensuring compatibility with most systems and reducing the need for additional components.

Technical Specifications

Cellphone ICs HMC601LP4 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

HMC601LP4 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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