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CC1070-RTR1

Texas Instruments

CC1070-RTR1 by Texas Instruments

CC1070-RTR1 by Texas Instruments is a cellphone IC with 20 terminals in a square package. It operates b/w -40 to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

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Digiode

USA . 1,861 parts In-Stock

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Parana Technologies

USA . 1,789 parts In-Stock

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$5.862

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$6.644

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ChromeModa Solutions

Germany . 4,039 parts In-Stock

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$6.586

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$5.401

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IDEA Electronic Components Group

UK . 601 parts In-Stock

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$5.927

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AZTECH Wire

Italy . 482 parts In-Stock

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One Stop Electronics

USA . 690 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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DigiPath Technology Company

USA . 2,030 parts In-Stock

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Corphita

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Northwest PG Solutions

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Native Components

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Kepictronics

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Overview

Enhance your cellphone's performance with the CC1070-RTR1 from Texas Instruments. This cutting-edge Cellphone IC boasts top-quality manufacturing, ensuring reliability and efficiency. Whether you're looking to improve signal reception or optimize power consumption, this device delivers. With its compact square package shape and advanced technology, the CC1070-RTR1 is the perfect solution for a wide range of telecom applications. Upgrade your device today and experience seamless connectivity like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, reducing manufacturing costs and increasing production speed.

Package Shape: SQUARE

The square package shape provides a compact design, saving space on the circuit board and allowing for more components to be placed in a smaller area.

Power Supplies (V): 2.5/3.3

The availability of multiple power supply options (2.5V and 3.3V) allows for flexibility in system design and compatibility with various voltage requirements.

No. of Terminals: 20

With 20 terminals, this IC can support a wide range of functions and connectivity options, making it versatile for different applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation, compact size, and improved performance in a variety of operating environments.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures reliable performance in demanding conditions without risking damage due to overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in extreme cold environments without compromising functionality or reliability.

Terminal Position: QUAD

The quad terminal position provides stable and secure connections to the circuit board, minimizing signal interference and ensuring consistent performance.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for a slim and streamlined design, making it suitable for applications where space is limited.

Width: 5 mm

The small width of 5mm enhances compatibility with various board layouts and configurations, enabling easier integration into different electronic devices.

Length: 5 mm

The compact length of 5mm contributes to the overall space-saving design of the IC, making it ideal for applications where size constraints are a concern.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification ensures that the IC can operate reliably in harsh industrial environments with high temperature fluctuations and demanding conditions.

Technology: CMOS

The use of CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making the IC energy-efficient and reliable.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead-based soldering issues, enhancing the environmental friendliness and long-term reliability of the IC.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The RF and baseband circuit integration enables seamless communication functions in telecom applications, providing a comprehensive solution for wireless connectivity and data transmission.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage ensures stable and consistent power delivery to the IC, supporting optimal performance without the risk of overloading or underpowering.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65mm allows for precise and secure connections to the circuit board, reducing the risk of signal interference and ensuring reliable operation in high-frequency applications.

Technical Specifications

Cellphone ICs CC1070-RTR1 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Length:

5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.20SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

CC1070-RTR1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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