Loading...

CC1000PWRG3

Texas Instruments

CC1000PWRG3 by Texas Instruments

CC1000PWRG3 by Texas Instruments is a cellphone IC with 28 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 2.5/3.3V and telecom IC type for RF and baseband circuits. The package is small outline, thin profile, with gull wing terminals suitable for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,152 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,152

-

-

-

-

Digiode

USA . 3,070 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,070

-

-

-

-

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,151 parts In-Stock

1+ parts

$8.649

100+ parts

-

1k+ parts

-

10k+ parts

-

1,151

$8.649

-

-

-

Parana Technologies

USA . 438 parts In-Stock

1+ parts

$11.299

100+ parts

-

1k+ parts

$11.729

10k+ parts

-

438

$11.299

-

$11.729

-

DigiPath Technology Company

USA . 732 parts In-Stock

1+ parts

$12.442

100+ parts

$11.447

1k+ parts

-

10k+ parts

-

732

$12.442

$11.447

-

-

ChromeModa Solutions

Germany . 6,052 parts In-Stock

1+ parts

$12.696

100+ parts

$10.411

1k+ parts

-

10k+ parts

-

6,052

$12.696

$10.411

-

-

IDEA Electronic Components Group

UK . 916 parts In-Stock

1+ parts

$12.696

100+ parts

$12.061

1k+ parts

$11.426

10k+ parts

-

916

$12.696

$12.061

$11.426

-

AZTECH Wire

Italy . 382 parts In-Stock

1+ parts

$18.574

100+ parts

-

1k+ parts

-

10k+ parts

-

382

$18.574

-

-

-

One Stop Electronics

USA . 909 parts In-Stock

1+ parts

$520.000

100+ parts

-

1k+ parts

-

10k+ parts

-

909

$520.000

-

-

-

Semicontronic

India . 1,129 parts In-Stock

1+ parts

$703.000

100+ parts

$685.425

1k+ parts

$681.910

10k+ parts

-

1,129

$703.000

$685.425

$681.910

-

Ampacity Inc.

Singapore . 1,116 parts In-Stock

1+ parts

$908.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,116

$908.000

-

-

-

Continental Prestige Electronics

USA . 6,646 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,646

-

-

-

-

Corphita

USA . 4,544 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,544

-

-

-

-

Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,790

-

-

-

-

Argo Parts USA

USA . 3,692 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,692

-

-

-

-

Bastille Electronics

Australia . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Experience the next level of performance with the CC1000PWRG3 by Texas Instruments. Designed with cutting-edge technology and superior craftsmanship, this cellphone IC offers unmatched reliability and efficiency. Perfect for a wide range of applications, this product provides seamless integration and exceptional functionality. With Texas Instruments' reputation for excellence, you can trust that the CC1000PWRG3 delivers unparalleled value and innovation. Upgrade your device with this high-quality component and experience the difference today.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material is durable and lightweight, making it a reliable choice for mobile devices.

Surface Mount

YES - Surface mount technology allows for easy installation and space-saving design.

Package Shape

RECTANGULAR - Rectangular shape provides compatibility with standard PCB layouts.

Power Supplies (V)

2.5/3.3 - Compatible with common voltage requirements in cellphone applications.

No. of Terminals

28 - Sufficient number of terminals for connecting various components in a cellphone circuit.

Package Style (Meter)

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Compact design saves space and allows for efficient heat dissipation.

Maximum Operating Temperature

85 °C - Able to withstand high operating temperatures in demanding environments.

Minimum Operating Temperature

40 °C - Can operate reliably in cold temperatures without performance degradation.

Terminal Finish

NICKEL PALLADIUM GOLD - Provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position

DUAL - Dual terminal position offers flexibility in circuit configuration.

Maximum Seated Height

1.2 mm - Low profile design ensures compatibility with slim cellphone designs.

Width

4.4 mm - Compact width allows for space-saving integration in mobile devices.

Maximum Time At Peak Reflow Temperature (s)

30 - Ensures proper soldering during assembly without damaging the component.

Peak Reflow Temperature °C

260 - Can withstand high reflow temperatures during assembly processes.

Length

9.7 mm - Length is suitable for integration into compact cellphone designs.

Temperature Grade

INDUSTRIAL - Designed to operate reliably in industrial temperature conditions.

Technology

CMOS - CMOS technology offers low power consumption and high-speed performance.

Terminal Form

GULL WING - Gull wing terminals provide secure connections for stable operation.

Telecom IC Type

RF AND BASEBAND CIRCUIT - Designed specifically for RF and baseband circuit applications in cellphones.

Nominal Supply Voltage

3 V - Compatible with standard voltage requirements in cellphone circuits.

Terminal Pitch

0.65 mm - Fine terminal pitch allows for high-density mounting on PCBs.

Moisture Sensitivity Level (MSL)

3 - MSL 3 rating indicates resistance to moisture during storage and handling.

Technical Specifications

Cellphone ICs CC1000PWRG3 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

CC1000PWRG3 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19