Loading...

ADC31RF80IRMPT

Texas Instruments

ADC31RF80IRMPT by Texas Instruments

Texas Instruments' ADC31RF80IRMPT is a 72-terminal cellphone IC with a square package shape and nickel palladium gold finish. Operating b/w -40 to 85°C, it's ideal for RF and baseband circuits in telecom applications. With a low profile of 0.9mm, it features a supply current of 1439mA at 1.15V nominal voltage.

Median Price

$1,003.748

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,169 parts In-Stock

1+ parts

$654.240

100+ parts

$592.200

1k+ parts

$564.000

10k+ parts

-

2,169

$654.240

$592.200

$564.000

-

Rochester

USA . 1,000 parts In-Stock

1+ parts

$892.220

100+ parts

$838.690

1k+ parts

$785.150

10k+ parts

-

1,000

$892.220

$838.690

$785.150

-

Verical

USA . 1,000 parts In-Stock

1+ parts

$1,115.275

100+ parts

$1,048.362

1k+ parts

$981.438

10k+ parts

-

1,000

$1,115.275

$1,048.362

$981.438

-

DigiKey

USA . 1,000 parts In-Stock

1+ parts

$1,115.280

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$1,115.280

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,523 parts In-Stock

1+ parts

$621.528

100+ parts

-

1k+ parts

-

10k+ parts

-

2,523

$621.528

-

-

-

Vyrian

USA . 5,999 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,999

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 900 parts In-Stock

1+ parts

$0.299

100+ parts

-

1k+ parts

-

10k+ parts

$0.287

900

$0.299

-

-

$0.287

Northwest PG Solutions

USA . 757 parts In-Stock

1+ parts

$0.329

100+ parts

-

1k+ parts

-

10k+ parts

$0.290

757

$0.329

-

-

$0.290

Parana Technologies

USA . 2,091 parts In-Stock

1+ parts

$14.126

100+ parts

-

1k+ parts

$14.590

10k+ parts

-

2,091

$14.126

-

$14.590

-

IDEA Electronic Components Group

UK . 2,029 parts In-Stock

1+ parts

$15.872

100+ parts

$15.078

1k+ parts

$14.285

10k+ parts

-

2,029

$15.872

$15.078

$14.285

-

ChromeModa Solutions

Germany . 1,597 parts In-Stock

1+ parts

$15.872

100+ parts

$13.015

1k+ parts

-

10k+ parts

-

1,597

$15.872

$13.015

-

-

Microchip USA

USA . 1,698 parts In-Stock

1+ parts

$511.830

100+ parts

$493.220

1k+ parts

$483.910

10k+ parts

$474.610

1,698

$511.830

$493.220

$483.910

$474.610

Ampacity Inc.

Singapore . 1,279 parts In-Stock

1+ parts

$556.100

100+ parts

-

1k+ parts

-

10k+ parts

-

1,279

$556.100

-

-

-

Semicontronic

India . 1,060 parts In-Stock

1+ parts

$556.100

100+ parts

$542.198

1k+ parts

$539.417

10k+ parts

-

1,060

$556.100

$542.198

$539.417

-

Corphita

USA . 441 parts In-Stock

1+ parts

$588.816

100+ parts

-

1k+ parts

-

10k+ parts

-

441

$588.816

-

-

-

Corohmni

South Africa . 438 parts In-Stock

1+ parts

$654.240

100+ parts

-

1k+ parts

-

10k+ parts

-

438

$654.240

-

-

-

DigiPath Technology Company

USA . 480 parts In-Stock

1+ parts

-

100+ parts

$14.310

1k+ parts

-

10k+ parts

-

480

-

$14.310

-

-

Overview

Experience the cutting-edge technology of the ADC31RF80IRMPT by Texas Instruments, a leading manufacturer in the industry. This cellphone IC offers unparalleled quality and reliability, making it a top choice for a wide range of applications. With a compact square package and advanced features, this product delivers exceptional performance in RF and baseband circuits. Trust Texas Instruments to provide innovative solutions that bring value and efficiency to your designs. Elevate your projects with the unmatched benefits and advantages of the ADC31RF80IRMPT.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and rework, making this product convenient for manufacturers and technicians.

Package Shape: SQUARE

The square package shape helps in efficient use of space on the PCB, allowing for compact and sleek cellphone designs.

No. of Terminals: 72

Having 72 terminals provides sufficient connectivity options for various functions and components within the cellphone IC.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables the cellphone IC to function in extreme cold environments without any issues.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish offers excellent conductivity and corrosion resistance, enhancing the overall reliability and longevity of the product.

Maximum Seated Height: 0.9 mm

The low maximum seated height allows for slim and sleek cellphone designs, saving valuable space within the device.

Maximum Supply Current: 1439 mA

Having a high maximum supply current ensures that the cellphone IC can power multiple functions and processes simultaneously without any performance issues.

Technical Specifications

Cellphone ICs ADC31RF80IRMPT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

72

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Current:

1439 mA

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

ADC31RF80IRMPT Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 1