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AD6655BCPZ-80

Analog Devices

AD6655BCPZ-80 by Analog Devices

AD6655BCPZ-80 by Analog Devices is a cellphone IC with 64 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, with a nominal voltage of 1.8V. Ideal for baseband circuits, it has a terminal pitch of 0.5mm and low profile at 1mm seated height.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,240 parts In-Stock

1+ parts

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7,240

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Digiode

USA . 909 parts In-Stock

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909

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,558 parts In-Stock

1+ parts

$7.475

100+ parts

-

1k+ parts

$6.952

10k+ parts

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1,558

$7.475

-

$6.952

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IDEA Electronic Components Group

UK . 1,528 parts In-Stock

1+ parts

$8.038

100+ parts

-

1k+ parts

$7.636

10k+ parts

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1,528

$8.038

-

$7.636

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AZTECH Wire

Italy . 490 parts In-Stock

1+ parts

$10.531

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490

$10.531

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DigiPath Technology Company

USA . 148 parts In-Stock

1+ parts

$12.539

100+ parts

$12.038

1k+ parts

-

10k+ parts

$12.038

148

$12.539

$12.038

-

$12.038

Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$12.673

100+ parts

$11.532

1k+ parts

$10.392

10k+ parts

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15

$12.673

$11.532

$10.392

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Ampacity Inc.

Singapore . 175 parts In-Stock

1+ parts

$299.000

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175

$299.000

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One Stop Electronics

USA . 1,216 parts In-Stock

1+ parts

$436.000

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1,216

$436.000

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Semicontronic

India . 269 parts In-Stock

1+ parts

$787.000

100+ parts

$767.325

1k+ parts

$763.390

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269

$787.000

$767.325

$763.390

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Northwest PG Solutions

USA . 2,168 parts In-Stock

1+ parts

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100+ parts

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$3.322

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2,168

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$3.322

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Corphita

USA . 919 parts In-Stock

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919

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Native Components

USA . 385 parts In-Stock

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100+ parts

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$3.288

10k+ parts

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385

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$3.288

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Overview

Discover the cutting-edge AD6655BCPZ-80 by Analog Devices, a top-of-the-line Cellphone IC that sets new standards in performance and reliability. With a reputation for excellence, Analog Devices delivers industry-leading solutions that exceed expectations. Ideal for a wide range of applications, this innovative IC offers unmatched value, benefits, and advantages to customers looking for high-quality, efficient components. Upgrade your devices with the AD6655BCPZ-80 and experience unparalleled performance like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for smaller, lighter, and more compact designs, making this product suitable for space-constrained applications.

Package Shape: SQUARE

The square package shape helps in efficient PCB layout and space utilization, making the product easy to integrate into different designs.

No. of Terminals: 64

With a high number of terminals, this product offers enhanced connectivity options and can support complex functionalities.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the reliability and durability of the product, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows the product to function effectively in harsh environmental conditions, increasing its versatility.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring long-term performance of the product.

Maximum Seated Height: 1 mm

The low maximum seated height contributes to a slim design and facilitates space-saving in compact electronic devices.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage helps in reducing power consumption and extending battery life, making it energy-efficient.

Technical Specifications

Cellphone ICs AD6655BCPZ-80 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Trade Compliance

AD6655BCPZ-80 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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