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AD6635BBC

Analog Devices

AD6635BBC by Analog Devices

AD6635BBC by Analog Devices is a Cellphone IC with 324 terminals in a GRID ARRAY package. Operating at -40 to 85 °C, it uses CMOS technology and has a supply voltage of 2.5V for BASEBAND CIRCUIT applications. The package measures 19x19mm with a terminal pitch of 1mm and TIN LEAD finish on the bottom terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,895 parts In-Stock

1+ parts

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8,895

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Digiode

USA . 492 parts In-Stock

1+ parts

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492

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 869 parts In-Stock

1+ parts

$0.179

100+ parts

-

1k+ parts

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10k+ parts

$0.172

869

$0.179

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-

$0.172

Northwest PG Solutions

USA . 965 parts In-Stock

1+ parts

$0.197

100+ parts

-

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$0.174

965

$0.197

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$0.174

Parana Technologies

USA . 600 parts In-Stock

1+ parts

$7.034

100+ parts

-

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$6.541

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600

$7.034

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$6.541

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IDEA Electronic Components Group

UK . 1,913 parts In-Stock

1+ parts

$7.563

100+ parts

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1k+ parts

$7.185

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1,913

$7.563

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$7.185

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AZTECH Wire

Italy . 450 parts In-Stock

1+ parts

$11.270

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450

$11.270

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DigiPath Technology Company

USA . 1,925 parts In-Stock

1+ parts

$11.798

100+ parts

$11.326

1k+ parts

-

10k+ parts

$11.326

1,925

$11.798

$11.326

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$11.326

Semicontronic

India . 1,320 parts In-Stock

1+ parts

$314.000

100+ parts

$306.150

1k+ parts

$304.580

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1,320

$314.000

$306.150

$304.580

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One Stop Electronics

USA . 862 parts In-Stock

1+ parts

$937.000

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862

$937.000

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Corphita

USA . 602 parts In-Stock

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602

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Overview

Unlock the full potential of your cellphone with the AD6635BBC by Analog Devices. Known for their superior quality and innovative technology, Analog Devices brings you a cutting-edge Cellphone IC that promises unrivaled performance. With a wide range of applications in telecommunications, this product offers seamless integration, reliability, and efficiency. Elevate your mobile experience with the value and benefits that only Analog Devices can deliver. Trust in the AD6635BBC to exceed your expectations and take your cellphone capabilities to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the IC components.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards.

Package Shape: SQUARE

Square package shape ensures a compact and space-saving design for the IC.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages allows for versatile compatibility in different device configurations.

No. of Terminals: 324

High number of terminals enable connectivity to various external components and peripherals.

Package Style (Meter): GRID ARRAY

Grid array package style offers increased connectivity and signal integrity.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for usage in a wide range of temperature conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and electrical conductivity.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure mounting onto PCBs.

Maximum Seated Height: 3.5 mm

Low seated height enables a slim and compact overall design for the IC.

Width: 19 mm

Standard width dimensions allow for easy integration into various device designs.

Length: 19 mm

Standard length dimensions ensure compatibility with industry-standard PCB layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating makes the IC suitable for rugged and harsh environments.

Technology: CMOS

CMOS technology offers efficient power consumption and high-speed performance.

Terminal Form: BALL

Ball terminal form provides enhanced connectivity and reliability.

Telecom IC Type: BASEBAND CIRCUIT

Baseband circuit type is essential for processing and managing telecommunication signals effectively.

Nominal Supply Voltage: 2.5 V

Stable and reliable nominal supply voltage ensures consistent performance.

Terminal Pitch: 1 mm

Fine terminal pitch allows for high-density packaging and space-efficient PCB layouts.

Technical Specifications

Cellphone ICs AD6635BBC attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e0

Length:

19 mm

No. of Functions:

1

No. of Terminals:

324

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA324,18X18,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.5 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

19 mm

Trade Compliance

AD6635BBC Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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