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GC5016-PB

Texas Instruments

GC5016-PB by Texas Instruments

GC5016-PB by Texas Instruments is a Cellphone IC with 252 terminals in a square GRID ARRAY package. It operates b/w -40 to 85°C, with power supplies of 1.8V and 3.3V for RF and baseband circuits. The PLASTIC/EPOXY body material and TIN LEAD terminal finish make it suitable for industrial telecom applications.

Median Price

$46.496

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,576 parts In-Stock

1+ parts

-

100+ parts

$41.330

1k+ parts

$36.980

10k+ parts

$34.810

6,576

-

$41.330

$36.980

$34.810

DigiKey

USA . 6,576 parts In-Stock

1+ parts

-

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-

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6,576

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Verical

USA . 5,968 parts In-Stock

1+ parts

-

100+ parts

$51.663

1k+ parts

$46.225

10k+ parts

$43.513

5,968

-

$51.663

$46.225

$43.513

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 3 parts In-Stock

1+ parts

$22.000

100+ parts

-

1k+ parts

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10k+ parts

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3

$22.000

-

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DF Sales Co.

USA . 3 parts In-Stock

1+ parts

$22.000

100+ parts

-

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3

$22.000

-

-

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Digiode

USA . 58 parts In-Stock

1+ parts

$43.643

100+ parts

-

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-

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58

$43.643

-

-

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Vyrian

USA . 4,708 parts In-Stock

1+ parts

$45.940

100+ parts

-

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4,708

$45.940

-

-

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Sogenti Electronics

Canada . 66 parts In-Stock

1+ parts

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66

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Odintec Ltd.

Israel . 63 parts In-Stock

1+ parts

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63

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Semtec, LLC

USA . 30 parts In-Stock

1+ parts

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30

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North Shore Components

USA . 26 parts In-Stock

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26

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Bristol Electronics

USA . 20 parts In-Stock

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20

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Prism Electronics

USA . 9 parts In-Stock

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9

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Freelance Electronics

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 110 parts In-Stock

1+ parts

$6.436

100+ parts

$597.725

1k+ parts

$5.793

10k+ parts

-

110

$6.436

$597.725

$5.793

-

DigiPath Technology Company

USA . 1,842 parts In-Stock

1+ parts

$7.087

100+ parts

$6.520

1k+ parts

-

10k+ parts

-

1,842

$7.087

$6.520

-

-

ChromeModa Solutions

Germany . 5,176 parts In-Stock

1+ parts

$7.232

100+ parts

$5.930

1k+ parts

-

10k+ parts

-

5,176

$7.232

$5.930

-

-

IDEA Electronic Components Group

UK . 1,627 parts In-Stock

1+ parts

$7.232

100+ parts

-

1k+ parts

$6.509

10k+ parts

-

1,627

$7.232

-

$6.509

-

Advanced Electronics

New Zealand . 700 parts In-Stock

1+ parts

$10.333

100+ parts

$9.403

1k+ parts

$8.473

10k+ parts

-

700

$10.333

$9.403

$8.473

-

Corohmni

South Africa . 99 parts In-Stock

1+ parts

$10.404

100+ parts

-

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99

$10.404

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Corphita

USA . 704 parts In-Stock

1+ parts

$41.346

100+ parts

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704

$41.346

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Lixinc

USA . 11,926 parts In-Stock

1+ parts

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11,926

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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6,500

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A-Z Elektronik GmbH

Germany . 3,951 parts In-Stock

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3,951

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Northwest PG Solutions

USA . 1,238 parts In-Stock

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1,238

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Perfect Parts

USA . 180 parts In-Stock

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180

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Infinite Electronics LLP (Excess)

. 96 parts In-Stock

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96

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Cyclops Electronics Ltd (Excess)

UK . 76 parts In-Stock

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76

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Kepictronics

USA . 71 parts In-Stock

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71

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Native Components

USA . 57 parts In-Stock

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57

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Overview

Enhance the performance of your cellphone with the GC5016-PB by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality Cellphone ICs that are designed to optimize functionality and efficiency. Whether you're looking to improve signal reception, enhance data processing, or boost overall phone capabilities, this product offers undeniable value and benefits to customers. Upgrade your device today and experience the enhanced performance that Texas Instruments is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy, the package is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort in production.

Power Supplies (V): 1.8,3.3

Supporting power supplies of 1.8V and 3.3V makes this product compatible with a wide range of devices and systems.

No. of Terminals: 252

Having 252 terminals provides ample connectivity options, ensuring compatibility with various components and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style offers a compact and efficient design, optimizing space usage on circuit boards.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can function reliably even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Featuring a minimum operating temperature of -40°C, this product is suitable for use in cold conditions without compromising performance.

Terminal Finish: TIN LEAD

The tin lead terminal finish enhances conductivity and solderability, promoting a stable and secure connection in the circuit.

Width: 17 mm

The width of 17mm ensures compatibility with standard spacing requirements on circuit boards, facilitating easy integration.

Maximum Time At Peak Reflow Temperature (s): 20

Having a maximum time of 20 seconds at peak reflow temperature allows for efficient and precise soldering during assembly.

Peak Reflow Temperature °C: 220

The peak reflow temperature of 220°C ensures proper soldering of the terminals, enhancing the product's reliability.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this product meets the rigorous standards required for operation in harsh industrial environments.

Terminal Form: BALL

The ball terminal form provides a reliable and secure connection, minimizing the risk of disconnection or signal loss.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Featuring RF and baseband circuit capabilities, this product is well-suited for telecommunications applications, ensuring high-quality signal processing.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8V ensures efficient power consumption, contributing to the overall energy efficiency of the product.

Terminal Pitch: 1 mm

The 1mm terminal pitch facilitates easy connections and precise positioning on the circuit board, enhancing installation accuracy.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product is less susceptible to moisture damage, ensuring long-term reliability in varied environmental conditions.

Technical Specifications

Cellphone ICs GC5016-PB attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B252

JESD-609 Code:

e0

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

252

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.02 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

17 mm

Trade Compliance

GC5016-PB Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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