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CC113LRGPT

Texas Instruments

CC113LRGPT by Texas Instruments

The Texas Instruments CC113LRGPT is a cellphone IC with 20 terminals in a square chip carrier package. Operating at temperatures from -40 to 85°C, it supports RF and baseband circuits with a data rate of 0.6 Mbps. Ideal for industrial applications, this IC has a nominal voltage of 3V and terminal pitch of 0.5mm.

Median Price

$1.581

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 500 parts In-Stock

1+ parts

$1.350

100+ parts

$1.320

1k+ parts

$1.300

10k+ parts

-

500

$1.350

$1.320

$1.300

-

Texas Instruments

USA . 21,455 parts In-Stock

1+ parts

$1.581

100+ parts

$1.306

1k+ parts

$0.706

10k+ parts

-

21,455

$1.581

$1.306

$0.706

-

DigiKey

USA . 638 parts In-Stock

1+ parts

$2.150

100+ parts

$1.605

1k+ parts

$1.460

10k+ parts

-

638

$2.150

$1.605

$1.460

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,578 parts In-Stock

1+ parts

$1.502

100+ parts

-

1k+ parts

-

10k+ parts

-

1,578

$1.502

-

-

-

Vyrian

USA . 7,472 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,472

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10,730 parts In-Stock

1+ parts

$1.340

100+ parts

-

1k+ parts

-

10k+ parts

-

10,730

$1.340

-

-

-

Semicontronic

India . 10,466 parts In-Stock

1+ parts

$1.340

100+ parts

$1.306

1k+ parts

$1.300

10k+ parts

-

10,466

$1.340

$1.306

$1.300

-

Corphita

USA . 1,172 parts In-Stock

1+ parts

$1.423

100+ parts

-

1k+ parts

-

10k+ parts

-

1,172

$1.423

-

-

-

Corohmni

South Africa . 433 parts In-Stock

1+ parts

$1.581

100+ parts

-

1k+ parts

-

10k+ parts

-

433

$1.581

-

-

-

Parana Technologies

USA . 1,214 parts In-Stock

1+ parts

$8.930

100+ parts

-

1k+ parts

$9.600

10k+ parts

-

1,214

$8.930

-

$9.600

-

DigiPath Technology Company

USA . 161 parts In-Stock

1+ parts

$9.833

100+ parts

$9.047

1k+ parts

-

10k+ parts

-

161

$9.833

$9.047

-

-

ChromeModa Solutions

Germany . 3,202 parts In-Stock

1+ parts

$10.034

100+ parts

$8.228

1k+ parts

-

10k+ parts

-

3,202

$10.034

$8.228

-

-

IDEA Electronic Components Group

UK . 446 parts In-Stock

1+ parts

$10.034

100+ parts

$9.532

1k+ parts

$9.031

10k+ parts

-

446

$10.034

$9.532

$9.031

-

Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Lixinc

USA . 3,736 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,736

-

-

-

-

Northwest PG Solutions

USA . 921 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

921

-

-

-

-

Perfect Parts

USA . 672 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

672

-

-

-

-

Native Components

USA . 494 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

494

-

-

-

-

Robosynatics

Brazil . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

200

-

-

-

-

Lucentia Tech

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$6.445

1k+ parts

$5.968

10k+ parts

$5.968

200

-

$6.445

$5.968

$5.968

Overview

Elevate your cellphone's performance with the CC113LRGPT by Texas Instruments, a high-quality RF and baseband circuit designed to optimize communication capabilities. Manufactured with precision and expertise, this chip carrier boasts a very thin profile and advanced terminal finishes for seamless integration into your device. From improved data rates to reliable power supplies, this innovative solution offers unparalleled value and benefits to customers seeking cutting-edge technology for their mobile devices. Experience the difference with Texas Instruments and take your cellphone experience to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, which is ideal for portable devices like cellphones.

Surface Mount: YES

Surface mount technology allows for easy installation and replacement of the ICs, making the product user-friendly.

Power Supplies (V): 1.8/3.6

Support for dual power supplies provides flexibility in voltage requirements, making it suitable for a variety of applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Terminal Form: NO LEAD

Lead-free terminals make the product environmentally friendly and compliant with regulations.

Technical Specifications

Cellphone ICs CC113LRGPT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Data Rate:

.6 Mbps

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Trade Compliance

CC113LRGPT Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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