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ADF4360-9BCPZRL

Analog Devices

ADF4360-9BCPZRL by Analog Devices

Analog Devices' ADF4360-9BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features a square package shape, matte tin finish, and industrial temperature grade. Ideal for baseband circuits in telecom applications due to its compact size (4x4mm) and low profile (1mm).

Median Price

$4.923

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 5,000 parts In-Stock

1+ parts

-

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$4.923

5,000

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$4.923

Distributors (In-Stock)

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Vyrian

USA . 6,230 parts In-Stock

1+ parts

-

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6,230

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Digiode

USA . 969 parts In-Stock

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969

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 227 parts In-Stock

1+ parts

$0.451

100+ parts

-

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-

10k+ parts

$0.433

227

$0.451

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-

$0.433

Northwest PG Solutions

USA . 1,197 parts In-Stock

1+ parts

$0.496

100+ parts

-

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$0.438

1,197

$0.496

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$0.438

Vigor

Singapore . 5,548 parts In-Stock

1+ parts

$4.610

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5,548

$4.610

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AZTECH Wire

Italy . 217 parts In-Stock

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$5.550

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217

$5.550

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Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$9.570

100+ parts

$8.709

1k+ parts

$7.847

10k+ parts

-

270

$9.570

$8.709

$7.847

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Parana Technologies

USA . 708 parts In-Stock

1+ parts

$15.215

100+ parts

-

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$14.150

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708

$15.215

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$14.150

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IDEA Electronic Components Group

UK . 964 parts In-Stock

1+ parts

$16.360

100+ parts

$15.542

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$15.542

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964

$16.360

$15.542

$15.542

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Corohmni

South Africa . 125 parts In-Stock

1+ parts

$16.486

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$16.486

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Microchip USA

USA . 7,773 parts In-Stock

1+ parts

$16.720

100+ parts

$16.480

1k+ parts

$16.360

10k+ parts

$16.240

7,773

$16.720

$16.480

$16.360

$16.240

DigiPath Technology Company

USA . 2,877 parts In-Stock

1+ parts

$25.522

100+ parts

$24.501

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-

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$24.501

2,877

$25.522

$24.501

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$24.501

Component Stockers USA

USA . 594 parts In-Stock

1+ parts

$94.780

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594

$94.780

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Semicontronic

India . 1,538 parts In-Stock

1+ parts

$157.000

100+ parts

$153.075

1k+ parts

$152.290

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1,538

$157.000

$153.075

$152.290

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One Stop Electronics

USA . 489 parts In-Stock

1+ parts

$176.000

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489

$176.000

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Corphita

USA . 372 parts In-Stock

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372

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Overview

Enhance the performance of your cellphone with the ADF4360-9BCPZRL by Analog Devices. Known for their top-quality manufacturing, Analog Devices delivers cutting-edge Cellphone ICs that are designed to optimize functionality and efficiency. This square-shaped, surface-mount package offers customers a seamless integration process while providing exceptional power supplies of 3.3V. Perfect for telecom applications, this product boasts a wide temperature range and robust terminal finish in matte tin. Elevate your cellphone's capabilities with the ADF4360-9BCPZRL and experience unparalleled quality and reliability.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient PCB assembly, reducing production time and costs.

Package Shape: SQUARE

Square packages are typically space-efficient and easy to handle during assembly, making them a practical choice for compact devices.

Power Supplies (V): 3.3

Low voltage operation can help in reducing power consumption and extending battery life in mobile devices.

No. of Terminals: 24

Sufficient number of terminals for connecting various components and functionalities, allowing for a versatile design.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures the device can operate in extreme cold conditions without compromising functionality.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and conductivity, enhancing the reliability of solder joints.

Terminal Position: QUAD

Quad terminal layout allows for efficient routing of signals and power, optimizing PCB layout and performance.

Width: 4 mm

Compact width facilitates space-saving design and integration into small form factor devices.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and connection reliability during manufacturing.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance makes the IC suitable for rugged and harsh environments.

Technical Specifications

Cellphone ICs ADF4360-9BCPZRL attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

ADF4360-9BCPZRL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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