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ADF4360-4BCPZRL

Analog Devices

ADF4360-4BCPZRL by Analog Devices

Analog Devices' ADF4360-4BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, quad terminal position, and matte tin finish. Ideal for baseband circuits in telecom applications, it has a compact square package with a very thin profile and can withstand industrial temperatures from -40 to 85°C.

Median Price

$6.345

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$5.970

100+ parts

-

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15

$5.970

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Vyrian

USA . 2,920 parts In-Stock

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2,920

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Digiode

USA . 277 parts In-Stock

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277

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Component Sense

UK . 39 parts In-Stock

1+ parts

-

100+ parts

$6.721

1k+ parts

$6.721

10k+ parts

$6.721

39

-

$6.721

$6.721

$6.721

VNN

France . 25 parts In-Stock

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25

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,317 parts In-Stock

1+ parts

$5.970

100+ parts

-

1k+ parts

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10k+ parts

$5.851

5,317

$5.970

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-

$5.851

Parana Technologies

USA . 671 parts In-Stock

1+ parts

$9.863

100+ parts

-

1k+ parts

$9.172

10k+ parts

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671

$9.863

-

$9.172

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Aztec Data Supply Inc.

USA . 3,345 parts In-Stock

1+ parts

$10.450

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3,345

$10.450

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IDEA Electronic Components Group

UK . 1,333 parts In-Stock

1+ parts

$10.605

100+ parts

-

1k+ parts

$10.075

10k+ parts

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1,333

$10.605

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$10.075

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AZTECH Wire

Italy . 374 parts In-Stock

1+ parts

$15.714

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374

$15.714

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DigiPath Technology Company

USA . 507 parts In-Stock

1+ parts

$16.544

100+ parts

$15.882

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$15.882

507

$16.544

$15.882

-

$15.882

One Stop Electronics

USA . 132 parts In-Stock

1+ parts

$164.000

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132

$164.000

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Ampacity Inc.

Singapore . 428 parts In-Stock

1+ parts

$418.000

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428

$418.000

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Semicontronic

India . 988 parts In-Stock

1+ parts

$840.000

100+ parts

$819.000

1k+ parts

$814.800

10k+ parts

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988

$840.000

$819.000

$814.800

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Microchip USA

USA . 7,776 parts In-Stock

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7,776

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Argo Parts USA

USA . 4,155 parts In-Stock

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4,155

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

$5.851

1k+ parts

$5.671

10k+ parts

$5.552

1,000

-

$5.851

$5.671

$5.552

Advanced Electronics

New Zealand . 750 parts In-Stock

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750

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Corphita

USA . 475 parts In-Stock

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475

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Overview

Enhance the performance of your cellphone with the ADF4360-4BCPZRL by Analog Devices. Known for their top-notch quality and expertise in the industry, Analog Devices delivers cutting-edge Cellphone ICs that are surface mountable and feature a square package shape. This versatile product offers industrial-grade temperature stability, making it ideal for various telecom applications. Upgrade your device today and experience the value and benefits of Analog Devices' advanced technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto a circuit board, saving time and cost.

Package Shape: SQUARE

The square package shape ensures efficient use of space on the circuit board, optimizing the overall design and layout.

Power Supplies (V): 3.3

Operating at a voltage of 3.3V makes this product compatible with a wide range of standard power supplies and devices.

No. of Terminals: 24

Having 24 terminals allows for more connectivity options and functionalities within the product, increasing its flexibility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provide efficient thermal dissipation and space-saving features.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand rigorous usage in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the product's reliability and functionality even in extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin finish on the terminals provides corrosion resistance and ensures a good electrical connection for reliable performance.

Terminal Position: QUAD

The quad terminal position enables easy soldering and connection to the circuit board, simplifying the assembly process.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for a compact design and space-saving installation on the circuit board.

Width: 4 mm

The narrow width of 4mm contributes to the product's slim profile, making it suitable for compact electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds helps prevent overheating and ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient soldering and bonding of the product to the circuit board.

Length: 4 mm

The short length of 4mm contributes to the product's compact size and space-saving design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that the product is suitable for use in harsh industrial environments, ensuring its durability and reliability.

Technology: BICMOS

The BICMOS technology combines the advantages of both bipolar and CMOS technologies, providing high performance and low power consumption.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and complies with regulations, making the product a sustainable choice.

Telecom IC Type: BASEBAND CIRCUIT

Being a baseband circuit telecom IC type, this product is designed for processing and managing telecommunications signals efficiently and reliably.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is a standard and widely used value, ensuring compatibility with various electronic systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density packaging and efficient use of space on the circuit board.

Moisture Sensitivity Level (MSL): 3

The MSL of 3 indicates that the product has moderate moisture sensitivity, requiring proper handling and storage to prevent damage during assembly.

Technical Specifications

Cellphone ICs ADF4360-4BCPZRL attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

ADF4360-4BCPZRL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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