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ADF4360-2BCPRL

Analog Devices

ADF4360-2BCPRL by Analog Devices

Analog Devices' ADF4360-2BCPRL is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85°C. It features BICMOS technology, square package shape, and quad terminal position for baseband circuit applications in telecom devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,622 parts In-Stock

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2,622

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VNN

France . 1,898 parts In-Stock

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Digiode

USA . 599 parts In-Stock

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599

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,938 parts In-Stock

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$9.841

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$9.841

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Corohmni

South Africa . 1,065 parts In-Stock

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$12.569

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$12.569

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Parana Technologies

USA . 1,085 parts In-Stock

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$14.778

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$13.743

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$14.778

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$13.743

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IDEA Electronic Components Group

UK . 1,507 parts In-Stock

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$15.890

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$15.096

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$15.096

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$15.096

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AZTECH Wire

Italy . 818 parts In-Stock

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$18.474

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DigiPath Technology Company

USA . 3,097 parts In-Stock

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$24.788

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$23.797

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$23.797

3,097

$24.788

$23.797

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$23.797

Semicontronic

India . 937 parts In-Stock

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$84.000

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$81.900

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$81.480

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937

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$81.480

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One Stop Electronics

USA . 1,359 parts In-Stock

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$217.000

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Ampacity Inc.

Singapore . 950 parts In-Stock

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$866.000

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Argo Parts USA

USA . 4,135 parts In-Stock

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Continental Prestige Electronics

USA . 3,395 parts In-Stock

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Corphita

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Enhance your cellphone's performance with the ADF4360-2BCPRL by Analog Devices. As a leader in the industry, Analog Devices provides top-notch quality and reliability. This Cellphone IC is designed for seamless integration, offering advanced features and functionality to optimize your device's performance. Upgrade your phone with this cutting-edge technology and experience enhanced speed, efficiency, and overall user satisfaction. Trust Analog Devices to deliver superior products that exceed expectations. Elevate your cellphone experience today with the ADF4360-2BCPRL.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Package Shape: SQUARE

Square package shape provides stability and ease of placement on the PCB.

Power Supplies (V): 3.3

Operates at a standard power supply voltage of 3.3V, ensuring compatibility with common power sources.

No. of Terminals: 24

Provides sufficient connection points for various functionalities and connections within the circuit.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combination offers thermal management capabilities along with a compact design for space-constrained applications.

Maximum Operating Temperature: 85 °C

Ensures reliable operation within a wide temperature range, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme temperature conditions, making it suitable for harsh environments.

Terminal Finish: TIN LEAD

Provides good solderability and ensures reliable electrical connections.

Terminal Position: QUAD

Quad terminal position allows for efficient routing of connections and enhances signal integrity.

Maximum Seated Height: 1 mm

Low seated height facilitates slim and compact device designs.

Width: 4 mm

Slim width enables space-saving integration in tight layouts.

Peak Reflow Temperature °C: 240

Withstands high reflow temperatures during assembly processes, ensuring solder joint reliability.

Length: 4 mm

Compact length contributes to the overall space efficiency of the product.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions.

Technology: BICMOS

Utilizes BiCMOS technology for a balance of high-speed digital performance and low-power analog capabilities.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and provides better solder joint reliability.

Telecom IC Type: BASEBAND CIRCUIT

Specifically designed for telecom applications, ensuring reliable and efficient baseband processing.

Nominal Supply Voltage: 3.3 V

Operates at a standard supply voltage of 3.3V, ensuring compatibility with various systems and power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, maximizing PCB space utilization.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate sensitivity to moisture, requiring standard handling procedures during storage and assembly.

Technical Specifications

Cellphone ICs ADF4360-2BCPRL attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

240

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

ADF4360-2BCPRL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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