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ADL5363XCPZ-R7

Analog Devices

ADL5363XCPZ-R7 by Analog Devices

ADL5363XCPZ-R7 by Analog Devices is a cellphone IC with BICMOS technology. It operates b/w -40 to 85°C, has 20 terminals in a square package style, and requires a nominal voltage of 5V. This RF and baseband circuit is ideal for telecom applications due to its compact size and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,038 parts In-Stock

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5,038

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Digiode

USA . 672 parts In-Stock

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672

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Distributors (Availability)

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Parana Technologies

USA . 240 parts In-Stock

1+ parts

$8.610

100+ parts

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$8.007

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240

$8.610

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$8.007

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IDEA Electronic Components Group

UK . 1,199 parts In-Stock

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$9.258

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$8.795

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1,199

$9.258

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$8.795

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DigiPath Technology Company

USA . 1,813 parts In-Stock

1+ parts

$14.442

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$13.865

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$13.865

1,813

$14.442

$13.865

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$13.865

AZTECH Wire

Italy . 402 parts In-Stock

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$18.958

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402

$18.958

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Native Components

USA . 316 parts In-Stock

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$25.045

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316

$25.045

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Northwest PG Solutions

USA . 751 parts In-Stock

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$27.550

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$24.795

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751

$27.550

$24.795

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One Stop Electronics

USA . 491 parts In-Stock

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$56.000

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491

$56.000

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Semicontronic

India . 574 parts In-Stock

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$235.000

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$229.125

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$227.950

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574

$235.000

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$227.950

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Corphita

USA . 529 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the ADL5363XCPZ-R7 from Analog Devices. Designed by a trusted manufacturer known for excellence, this high-quality cellphone IC offers unparalleled performance and reliability. With a compact square package and advanced features like RF and baseband circuit capability, this product is ideal for a wide range of applications. Elevate your projects with the superior value and benefits of the ADL5363XCPZ-R7, providing you with a competitive edge in today's fast-paced market.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for mass production.

Package Shape: SQUARE

Square package shape helps in saving space on the PCB, making it ideal for compact cellphone designs.

No. of Terminals: 20

With 20 terminals, this IC provides versatile connectivity options for various input and output signals in a cellphone.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions.

Width: 5 mm

Compact width allows for easier placement on the PCB, optimizing space utilization in the cellphone design.

Technology: BICMOS

BICMOS technology offers a combination of advantages of both bipolar and CMOS technologies, providing high performance and low power consumption.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage simplifies power management and compatibility with other components in the cellphone.

Technical Specifications

Cellphone ICs ADL5363XCPZ-R7 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

ADL5363XCPZ-R7 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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