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TCM4400EGGM

Texas Instruments

TCM4400EGGM by Texas Instruments

Texas Instruments TCM4400EGGM is a BICMOS technology Cellphone IC with 80 terminals in a square package. It operates at -25 to 85 °C, consuming 0.03 mA at 3V. Ideal for BASEBAND CIRCUIT applications due to its low profile and fine pitch design.

Median Price

$4.745

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 209 parts In-Stock

1+ parts

-

100+ parts

$4.400

1k+ parts

$3.940

10k+ parts

$3.700

209

-

$4.400

$3.940

$3.700

DigiKey

USA . 209 parts In-Stock

1+ parts

-

100+ parts

$5.090

1k+ parts

-

10k+ parts

-

209

-

$5.090

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,954 parts In-Stock

1+ parts

$4.646

100+ parts

-

1k+ parts

-

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1,954

$4.646

-

-

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Vyrian

USA . 4,441 parts In-Stock

1+ parts

-

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-

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-

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4,441

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-

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DigiKey Marketplace

USA . 209 parts In-Stock

1+ parts

-

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-

1k+ parts

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209

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,072 parts In-Stock

1+ parts

$4.401

100+ parts

-

1k+ parts

-

10k+ parts

-

1,072

$4.401

-

-

-

Parana Technologies

USA . 1,246 parts In-Stock

1+ parts

$10.886

100+ parts

-

1k+ parts

$11.361

10k+ parts

-

1,246

$10.886

-

$11.361

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DigiPath Technology Company

USA . 1,265 parts In-Stock

1+ parts

$11.987

100+ parts

$11.028

1k+ parts

-

10k+ parts

-

1,265

$11.987

$11.028

-

-

ChromeModa Solutions

Germany . 4,964 parts In-Stock

1+ parts

$12.232

100+ parts

$10.030

1k+ parts

-

10k+ parts

-

4,964

$12.232

$10.030

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IDEA Electronic Components Group

UK . 633 parts In-Stock

1+ parts

$12.232

100+ parts

$11.620

1k+ parts

$11.009

10k+ parts

-

633

$12.232

$11.620

$11.009

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GreenTree Electronics

Israel . 19,300 parts In-Stock

1+ parts

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19,300

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Metaverse IC Inc.

Canada . 952 parts In-Stock

1+ parts

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952

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A-Z Elektronik GmbH

Germany . 828 parts In-Stock

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828

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Overview

Unlock the full potential of your cellphone with the TCM4400EGGM by Texas Instruments. Manufactured with precision and expertise, this high-quality cellphone IC offers unparalleled performance and reliability. From enhancing signal strength to optimizing power efficiency, this versatile component is designed to elevate your device's capabilities. Whether you're a tech enthusiast or a seasoned professional, the TCM4400EGGM promises to deliver value and innovation that exceeds expectations. Upgrade your cellphone experience today with this cutting-edge technology from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and resistance to damage, making it suitable for long-term use.

Surface Mount: YES

Surface mount design allows for easy installation onto PCBs, saving time and effort during assembly.

Package Shape: SQUARE

Square package shape is space-efficient and provides a stable mounting surface for the IC.

Power Supplies (V): 3

Operating at a standard voltage of 3V ensures compatibility with a wide range of applications and power sources.

No. of Terminals: 80

Having 80 terminals allows for multiple connections and functionalities within the IC, increasing its versatility.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style provides efficient signal routing and space-saving design for compact devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the IC can withstand high temperatures without performance degradation.

Minimum Operating Temperature: -25 °C

Operating at a minimum temperature of -25°C ensures reliable performance even in cold environments.

Terminal Position: BOTTOM

Bottom terminal position allows for easy soldering and connection to the PCB, simplifying the assembly process.

Maximum Seated Height: 1.4 mm

Low maximum seated height enables a slim profile for the IC, ideal for space-constrained applications.

Width: 10 mm

Compact width of 10mm makes the IC suitable for small electronic devices with limited space.

Length: 10 mm

Short length of 10mm contributes to the overall compactness of the IC, ideal for portable devices.

Technology: BICMOS

BICMOS technology offers a balance of performance and power efficiency, making the IC suitable for a variety of applications.

Terminal Form: BALL

Ball terminal form provides reliable connections and solder joints, ensuring stability and durability during operation.

Maximum Supply Current: 0.03 mA

Low maximum supply current of 0.03mA helps in reducing power consumption and heat generation, enhancing energy efficiency.

Telecom IC Type: BASEBAND CIRCUIT

Baseband circuit design is essential for processing communication signals, making the IC suitable for telecom applications.

Nominal Supply Voltage: 3 V

Operating at a nominal voltage of 3V ensures consistent and reliable performance across various power sources.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm enables high-density mounting of the IC, maximizing functionality in a compact space.

Technical Specifications

Cellphone ICs TCM4400EGGM attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B80

Length:

10 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.03 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Trade Compliance

TCM4400EGGM Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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