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AD6673BCPZRL7-250

Analog Devices

AD6673BCPZRL7-250 by Analog Devices

AD6673BCPZRL7-250 by Analog Devices is a cellphone IC with 48 terminals, operating at -40 to 85°C. It has a supply voltage of 1.8V and consumes 0.282mA current. This CMOS technology baseband circuit comes in a square chip carrier package suitable for industrial applications.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 2,560 parts In-Stock

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Digiode

USA . 786 parts In-Stock

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AZTECH Wire

Italy . 265 parts In-Stock

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$10.932

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Parana Technologies

USA . 226 parts In-Stock

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$14.269

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$13.270

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IDEA Electronic Components Group

UK . 426 parts In-Stock

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$15.343

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$14.576

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DigiPath Technology Company

USA . 3,070 parts In-Stock

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$23.935

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$22.978

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Native Components

USA . 536 parts In-Stock

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$80.770

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Northwest PG Solutions

USA . 1,507 parts In-Stock

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$88.847

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Semicontronic

India . 248 parts In-Stock

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$87.750

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One Stop Electronics

USA . 963 parts In-Stock

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Corphita

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Component Stockers USA

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Overview

Discover the cutting-edge AD6673BCPZRL7-250 by Analog Devices, a must-have for cellphone IC applications. With a reputation for top-notch quality and reliability, Analog Devices delivers unmatched performance with this surface-mount chip carrier. Boasting a very thin profile and a wide operating temperature range from -40 to 85°C, this industrial-grade telecom IC promises optimal functionality. Benefit from its low supply current of only 0.282 mA and nominal supply voltage of 1.8V, ensuring efficient power consumption without sacrificing performance. Upgrade your devices with the AD6673BCPZRL7-250 today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto a PCB, reducing manufacturing costs and improving reliability.

Power Supplies (V): 1.8

Operating at a low voltage of 1.8V reduces power consumption, making the product more energy-efficient.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and a very thin profile package style allows for effective heat dissipation, ensuring the product operates at optimal temperatures even under heavy loads.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand harsh environmental conditions and maintain reliable performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product suitable for energy-efficient and high-performance applications.

Technical Specifications

Cellphone ICs AD6673BCPZRL7-250 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.282 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

AD6673BCPZRL7-250 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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