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AD6636CBC

Analog Devices

AD6636CBC by Analog Devices

AD6636CBC by Analog Devices is a Cellphone IC with 256 terminals in a square grid array package. Operating temperature ranges from -40 to 85°C, suitable for industrial telecom applications requiring RF and baseband circuits. It has a low profile of 1.85mm, terminal pitch of 1mm, and operates at a nominal voltage of 1.8V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,530 parts In-Stock

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Digiode

USA . 488 parts In-Stock

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488

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Distributors (Availability)

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Native Components

USA . 85 parts In-Stock

1+ parts

$0.640

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85

$0.640

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Northwest PG Solutions

USA . 411 parts In-Stock

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$0.704

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411

$0.704

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Parana Technologies

USA . 655 parts In-Stock

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$13.157

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$12.236

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655

$13.157

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$12.236

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IDEA Electronic Components Group

UK . 1,353 parts In-Stock

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$14.147

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$13.440

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$13.440

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1,353

$14.147

$13.440

$13.440

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AZTECH Wire

Italy . 461 parts In-Stock

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$15.988

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461

$15.988

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DigiPath Technology Company

USA . 715 parts In-Stock

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$22.069

100+ parts

$21.187

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$21.187

715

$22.069

$21.187

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$21.187

One Stop Electronics

USA . 1,221 parts In-Stock

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$419.000

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$419.000

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Semicontronic

India . 1,526 parts In-Stock

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$931.000

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$907.725

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$903.070

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1,526

$931.000

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$903.070

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Glotronic Ltd.

UK . 3,300 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Corphita

USA . 426 parts In-Stock

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A-Z Elektronik GmbH

Germany . 206 parts In-Stock

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Overview

Unlock the potential of your cellphone with the AD6636CBC by Analog Devices. Manufactured by a trusted leader in the industry, this high-quality Cellphone IC offers top-tier performance and reliability. Perfect for RF and baseband circuits, this product delivers unparalleled value and benefits to customers. Whether you're looking to enhance your phone's connectivity or improve overall performance, the AD6636CBC is the solution you need. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the cellphone IC, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on PCBs, improving efficiency in the manufacturing process.

Package Shape: SQUARE

Square shape helps in optimal space utilization on the PCB layout, enabling compact and efficient design.

No. of Terminals: 256

Higher number of terminals allows for more connections and functionalities within the IC.

Package Style: GRID ARRAY

Grid array package style provides better thermal and electrical performance, making it suitable for high-performance applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can perform reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the IC can function in extreme cold environments without any issues.

Terminal Position: BOTTOM

Bottom terminal position helps in easy soldering and maintenance of the IC during assembly.

Maximum Seated Height: 1.85 mm

Low seated height allows for slim and compact designs of mobile devices.

Width: 17 mm

Compact width enables the IC to fit in tight spaces within the device, contributing to overall miniaturization.

Peak Reflow Temperature °C: 240

High peak reflow temperature ensures proper soldering of the IC during the manufacturing process for secure connections.

Length: 17 mm

Optimal length for fitting the IC in various mobile device designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the IC can withstand harsh operating conditions in different industries.

Terminal Form: BALL

Ball terminal form provides reliable connections and allows for easy rework if required.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combination of RF and baseband circuit in the IC enables seamless communication in mobile devices.

Nominal Supply Voltage: 1.8 V

Low supply voltage requirement helps in reducing power consumption and improving efficiency.

Terminal Pitch: 1 mm

Close terminal pitch enables more terminals in a compact space, facilitating complex functions within the IC.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the IC can withstand exposure to higher moisture levels during storage or transportation without damage.

Technical Specifications

Cellphone ICs AD6636CBC attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B256

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

240

Maximum Seated Height:

1.85 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

17 mm

Trade Compliance

AD6636CBC Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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