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AD6643BCPZ-200

Analog Devices

AD6643BCPZ-200 by Analog Devices

AD6643BCPZ-200 by Analog Devices is a cellphone IC with 2 functions, operating at 1.8V. It features a square package style, matte tin terminal finish, and industrial temperature grade. Ideal for RF and baseband circuits in telecommunications applications due to its compact size and low supply current of 0.26mA.

Median Price

$102.400

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 7 parts In-Stock

1+ parts

$102.400

100+ parts

$87.880

1k+ parts

$87.880

10k+ parts

$87.880

7

$102.400

$87.880

$87.880

$87.880

Analog Devices Inc

USA . 490 parts In-Stock

1+ parts

$155.580

100+ parts

-

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$94.380

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490

$155.580

-

$94.380

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Rochester

USA . 1,550 parts In-Stock

1+ parts

-

100+ parts

$81.570

1k+ parts

$72.980

10k+ parts

$68.690

1,550

-

$81.570

$72.980

$68.690

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 287 parts In-Stock

1+ parts

$86.317

100+ parts

-

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287

$86.317

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Vyrian

USA . 70 parts In-Stock

1+ parts

$90.860

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70

$90.860

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Cyclops Electronics Ltd

UK . 1,567 parts In-Stock

1+ parts

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1,567

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 876 parts In-Stock

1+ parts

$0.928

100+ parts

-

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876

$0.928

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Northwest PG Solutions

USA . 884 parts In-Stock

1+ parts

$1.021

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884

$1.021

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Parana Technologies

USA . 1,360 parts In-Stock

1+ parts

$8.171

100+ parts

-

1k+ parts

$7.599

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1,360

$8.171

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$7.599

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IDEA Electronic Components Group

UK . 889 parts In-Stock

1+ parts

$8.786

100+ parts

-

1k+ parts

$8.347

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889

$8.786

-

$8.347

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DigiPath Technology Company

USA . 239 parts In-Stock

1+ parts

$13.706

100+ parts

$13.158

1k+ parts

-

10k+ parts

$13.158

239

$13.706

$13.158

-

$13.158

Semicontronic

India . 1,674 parts In-Stock

1+ parts

$77.230

100+ parts

$75.299

1k+ parts

$74.913

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1,674

$77.230

$75.299

$74.913

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Corphita

USA . 584 parts In-Stock

1+ parts

$81.774

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584

$81.774

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Component Stockers USA

USA . 2,086 parts In-Stock

1+ parts

$92.010

100+ parts

$86.490

1k+ parts

$78.210

10k+ parts

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2,086

$92.010

$86.490

$78.210

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QUARKTWIN TECHNOLOGY LTD

USA . 11,705 parts In-Stock

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11,705

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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RC Electronics

USA . 2,953 parts In-Stock

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2,953

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Metaverse IC Inc.

Canada . 794 parts In-Stock

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794

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GreenTree Electronics

Israel . 340 parts In-Stock

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340

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A-Z Elektronik GmbH

Germany . 123 parts In-Stock

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123

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Perfect Parts

USA . 7 parts In-Stock

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Overview

Elevate your cellphone's performance with the AD6643BCPZ-200 by Analog Devices. This cutting-edge Cellphone IC offers unparalleled quality and reliability, backed by the reputable manufacturer, Analog Devices. With its sleek surface mount design and innovative features, this IC is perfect for a wide range of applications in the telecommunications industry. Experience seamless connectivity and optimal functionality with the AD6643BCPZ-200, delivering exceptional value and efficiency to customers seeking top-notch performance in their devices.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and reliable integration onto circuit boards, making installation and assembly more efficient.

No. of Functions: 2

Having multiple functions in a single IC reduces the need for multiple components, saving space and reducing complexity in the overall design.

Package Shape: SQUARE

The square package shape is compact and space-efficient, allowing for more efficient use of board space and facilitating better heat dissipation.

Power Supplies (V): 1.8

Operating at a low voltage of 1.8V helps in reducing power consumption and heat generation, leading to improved energy efficiency.

No. of Terminals: 64

Having a higher number of terminals allows for more connectivity options and functionality, enabling versatile applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offer enhanced thermal management and space-saving advantages.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance of 85°C ensures reliable performance even under demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in a wide range of temperature environments without compromising functionality.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring stable electrical connections over time.

Terminal Position: QUAD

The quad terminal position offers improved stability and mechanical support, reducing the risk of damage during handling and installation.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for a compact and space-saving design, suitable for applications with limited vertical space.

Width: 9 mm

The compact width of 9mm enables integration into smaller devices and circuit layouts, contributing to overall space efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds helps prevent thermal stress and ensure the reliability of solder connections.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the IC can withstand soldering processes without degradation, ensuring robust assembly.

Length: 9 mm

The compact length of 9mm offers flexibility in PCB layout and design, enabling efficient use of available space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh industrial environments, making the IC suitable for rugged applications.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead-related environmental concerns and enhances the IC's compliance with modern industry standards.

Maximum Supply Current: 0.26 mA

Operating with a low maximum supply current of 0.26 mA helps in minimizing power consumption and improving efficiency in electronic systems.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The inclusion of RF and baseband circuit types in the IC enables seamless integration into telecom applications, providing comprehensive functionality.

Nominal Supply Voltage: 1.8 V

Having a nominal supply voltage of 1.8V ensures compatibility with a wide range of systems and simplifies power management requirements.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm facilitates high-density mounting and enables compact PCB layouts, ideal for space-constrained designs.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the IC is resilient to moisture-related issues during storage, handling, and assembly processes.

Technical Specifications

Cellphone ICs AD6643BCPZ-200 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.26 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

AD6643BCPZ-200 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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