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HMC818LP4E

Analog Devices

HMC818LP4E by Analog Devices

Analog Devices' HMC818LP4E is a 24-terminal cellphone IC in a square chip carrier package with matte tin finish. Operating temperature range from -40 to 85°C, suitable for industrial telecom applications. Features RF and baseband circuits, nominal voltage of 3V, and terminal pitch of 0.5mm for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 107 parts In-Stock

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107

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Vyrian

USA . 7,684 parts In-Stock

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7,684

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Digiode

USA . 546 parts In-Stock

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546

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Distributors (Availability)

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Parana Technologies

USA . 2,174 parts In-Stock

1+ parts

$5.817

100+ parts

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$5.410

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2,174

$5.817

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$5.410

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IDEA Electronic Components Group

UK . 28 parts In-Stock

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$6.255

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$5.942

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28

$6.255

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$5.942

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DigiPath Technology Company

USA . 1,716 parts In-Stock

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$9.758

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$9.367

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1,716

$9.758

$9.367

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Component Stockers USA

USA . 784 parts In-Stock

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$99.990

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784

$99.990

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Semicontronic

India . 107 parts In-Stock

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$327.000

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$318.825

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$317.190

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107

$327.000

$318.825

$317.190

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QUARKTWIN TECHNOLOGY LTD

USA . 6,971 parts In-Stock

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6,971

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Corphita

USA . 798 parts In-Stock

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798

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Overview

Experience the next level of quality and reliability with the HMC818LP4E by Analog Devices. As a leading manufacturer in the industry, Analog Devices has once again delivered an exceptional product in the category of Cellphone ICs. With its advanced technology and innovative design, this chip carrier offers unmatched performance and versatility. From RF to baseband circuits, this product is the perfect solution for your telecommunications needs. Trust Analog Devices to deliver top-of-the-line products that exceed expectations and provide the value, benefits, and advantages you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components, ensuring durability and reliability of the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product, reducing production costs and improving overall performance.

Package Shape: SQUARE

The square shape of the package allows for compact design and efficient use of space, making the product suitable for smaller devices.

No. of Terminals: 24

Having 24 terminals provides the necessary connections for various functions and features, making the product versatile and capable of handling different tasks.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combination offers efficient heat dissipation, compact size, and compatibility with various devices, making it a versatile choice for different applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and extended usage without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation in cold environments, making the product suitable for a wide range of applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and conductivity, enhancing the overall performance and reliability of the product.

Terminal Position: QUAD

Quad terminal position allows for easy installation and connection, simplifying the assembly process and reducing the risk of errors.

Maximum Seated Height: 1 mm

The low seated height allows for a compact design and efficient use of space, making the product suitable for slim and portable devices.

Width: 4 mm

The narrow width of the product enables a sleek and compact design, making it ideal for space-constrained applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures stable and reliable connections during the manufacturing process, leading to a high-quality end product.

Length: 4 mm

The short length contributes to the product's compact design and space-saving features, making it a practical choice for smaller devices.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can withstand harsh operating conditions and maintain stable performance in demanding environments.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and compliant with regulations, making it a sustainable choice for manufacturers and consumers.

Telecom IC Type: RF AND BASEBAND CIRCUIT

This type of IC provides the necessary functions for communication devices, ensuring reliable wireless connectivity and signal processing capabilities.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 V, this product is energy-efficient and compatible with a wide range of power sources.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density packaging and precise connections, improving the overall performance and reliability of the product.

Technical Specifications

Cellphone ICs HMC818LP4E attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

HMC818LP4E Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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