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HMC832ALP6GE

Analog Devices

HMC832ALP6GE by Analog Devices

Analog Devices' HMC832ALP6GE is a 40-terminal cellphone IC with a square package shape and industrial temperature grade. It operates b/w -40 to 85°C, suitable for RF and baseband circuits in telecom applications. This surface-mount IC has a nominal voltage of 3.3V and terminal pitch of 0.5mm, making it ideal for compact designs requiring high performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,108 parts In-Stock

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Chip Stock

USA . 5,500 parts In-Stock

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5,500

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Digiode

USA . 23 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,238 parts In-Stock

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$9.070

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$9.070

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Corohmni

South Africa . 445 parts In-Stock

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$15.324

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445

$15.324

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Parana Technologies

USA . 4,070 parts In-Stock

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$16.595

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$15.433

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$16.595

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$15.433

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AZTECH Wire

Italy . 819 parts In-Stock

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$16.612

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819

$16.612

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IDEA Electronic Components Group

UK . 890 parts In-Stock

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$17.844

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$16.952

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$16.952

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890

$17.844

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$16.952

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Vigor

Singapore . 977 parts In-Stock

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$21.570

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$21.570

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DigiPath Technology Company

USA . 4,070 parts In-Stock

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$27.837

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$26.723

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$26.723

4,070

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$26.723

One Stop Electronics

USA . 1,581 parts In-Stock

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$50.000

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Semicontronic

India . 421 parts In-Stock

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$133.000

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$129.675

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$129.010

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Ampacity Inc.

Singapore . 844 parts In-Stock

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$856.000

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Lixinc

USA . 16,841 parts In-Stock

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RC Electronics

USA . 5,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,772 parts In-Stock

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Argo Parts USA

USA . 2,118 parts In-Stock

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Bastille Electronics

Australia . 870 parts In-Stock

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Corphita

USA . 845 parts In-Stock

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845

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Kepictronics

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Perfect Parts

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Overview

Enhance your cellphone performance with the HMC832ALP6GE by Analog Devices. Crafted with precision and expertise, this Cellphone IC boasts top-notch quality and reliability, setting it apart from the competition. Whether you're looking to optimize your RF and baseband circuits or enhance your device's overall functionality, this chip carrier with a very thin profile is the perfect solution. With a wide operating temperature range and no-lead terminal form, this Industrial-grade gem offers unmatched value and benefits to customers seeking superior telecom ICs. Elevate your mobile experience with the HMC832ALP6GE today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient assembly onto printed circuit boards, saving time and labor costs.

Package Shape: SQUARE

Square packages provide better thermal performance and are visually appealing, making the product more compact and aesthetically pleasing.

No. of Terminals: 40

Higher number of terminals allow for more connections and functionalities in the device, increasing its capabilities.

Maximum Operating Temperature: 85 °C

Wide temperature range ensures reliable operation in various environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold environments without performance degradation.

Terminal Finish: TIN

Tin finish provides good solderability and corrosion resistance, ensuring stable connections and longevity of the product.

Terminal Position: QUAD

Quad terminal position allows for efficient power distribution and signal routing, enhancing the performance of the IC.

Maximum Seated Height: 0.9 mm

Low seated height enables slim and compact designs, ideal for space-constrained applications.

Width: 6 mm

Compact width allows for efficient placement on PCBs, saving valuable board space.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time ensures quick and accurate soldering, reducing the risk of thermal damage to the IC.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints, preventing issues like cold solder joints or solder fractures.

Length: 6 mm

Compact length allows for versatile placement options within the device, optimizing space utilization.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures stable performance in harsh operating conditions, making it suitable for demanding environments.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and provides a safer option for manufacturing and disposal.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combination of RF and baseband circuitry offers versatile communication capabilities, making it suitable for advanced telecom applications.

Nominal Supply Voltage: 3.3 V

Stable supply voltage of 3.3V ensures consistent performance and compatibility, making it easy to integrate into various systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high density integration on PCBs, enabling complex circuit designs in limited space.

Technical Specifications

Cellphone ICs HMC832ALP6GE attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

HMC832ALP6GE Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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