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CC1021RSSR

Texas Instruments

CC1021RSSR by Texas Instruments

CC1021RSSR by Texas Instruments is a cellphone IC with 32 terminals in a square chip carrier package. Operating b/w -40 to 85°C, it features RF and baseband circuit technology, 0.1536 Mbps data rate, and 3V supply voltage. Ideal for industrial telecom applications due to its compact size (0.65mm pitch) and low profile (1mm height).

Median Price

$8.442

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 33,898 parts In-Stock

1+ parts

$8.442

100+ parts

$6.882

1k+ parts

$4.588

10k+ parts

-

33,898

$8.442

$6.882

$4.588

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,433 parts In-Stock

1+ parts

$8.020

100+ parts

-

1k+ parts

-

10k+ parts

-

2,433

$8.020

-

-

-

Vyrian

USA . 636 parts In-Stock

1+ parts

$8.442

100+ parts

-

1k+ parts

-

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-

636

$8.442

-

-

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TME

Poland . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.895

5,000

-

-

-

$2.895

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,449 parts In-Stock

1+ parts

$7.598

100+ parts

-

1k+ parts

-

10k+ parts

-

2,449

$7.598

-

-

-

Parana Technologies

USA . 2,208 parts In-Stock

1+ parts

$15.926

100+ parts

-

1k+ parts

$16.279

10k+ parts

-

2,208

$15.926

-

$16.279

-

DigiPath Technology Company

USA . 113 parts In-Stock

1+ parts

$17.536

100+ parts

-

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113

$17.536

-

-

-

ChromeModa Solutions

Germany . 4,825 parts In-Stock

1+ parts

$17.894

100+ parts

$14.673

1k+ parts

-

10k+ parts

-

4,825

$17.894

$14.673

-

-

IDEA Electronic Components Group

UK . 2,051 parts In-Stock

1+ parts

$17.894

100+ parts

$16.999

1k+ parts

$16.105

10k+ parts

-

2,051

$17.894

$16.999

$16.105

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Kepictronics

USA . 50,000 parts In-Stock

1+ parts

-

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50,000

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Component Stockers USA

USA . 28,344 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.890

10k+ parts

$4.890

28,344

-

-

$4.890

$4.890

Perfect Parts

USA . 13,867 parts In-Stock

1+ parts

-

100+ parts

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13,867

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Metaverse IC Inc.

Canada . 12,300 parts In-Stock

1+ parts

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12,300

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A-Z Elektronik GmbH

Germany . 7,322 parts In-Stock

1+ parts

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7,322

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QUARKTWIN TECHNOLOGY LTD

USA . 7,226 parts In-Stock

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7,226

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Alle Elektronik GmbH

Germany . 4,881 parts In-Stock

1+ parts

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4,881

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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100+ parts

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4,000

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-

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Northwest PG Solutions

USA . 1,618 parts In-Stock

1+ parts

-

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1,618

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Native Components

USA . 416 parts In-Stock

1+ parts

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416

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Overview

Elevate your cellphone's performance with the CC1021RSSR from Texas Instruments! As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and innovation. This cellphone IC boasts a sleek square package shape and versatile surface mount capabilities, making it ideal for a wide range of applications. With a nominal supply voltage of 3V and a data rate of 0.1536 Mbps, this chip carrier is designed to optimize your device's functionality. Experience the value and benefits of the CC1021RSSR today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the cellphone ICs onto circuit boards, making the product cost-effective and reliable.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, ideal for modern smartphones where space is a premium.

Power Supplies (V): 3

Operating at a standard voltage of 3V ensures compatibility with other components and power sources, improving overall system reliability.

No. of Terminals: 32

Having a high number of terminals allows for more connections and functionality within the cellphone ICs, catering to the diverse needs of modern mobile devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile packages enhances thermal management, performance, and overall form factor of the ICs for optimal functionality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the cellphone ICs can withstand rigorous usage and environmental conditions, improving product durability and longevity.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

The use of high-quality terminal finishes like nickel, palladium, gold, and silver enhances conductivity and corrosion resistance, ensuring long-term performance and reliability of the ICs.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high speed, and compatibility with various digital functions, making the ICs energy-efficient and versatile for mobile applications.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature conditions means the cellphone ICs are suitable for a wide range of operating environments, from extreme cold to hot temperatures, ensuring consistent performance in diverse scenarios.

Technical Specifications

Cellphone ICs CC1021RSSR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Data Rate:

.1536 Mbps

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

CC1021RSSR Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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