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CC1000YZ

Texas Instruments

CC1000YZ by Texas Instruments

CC1000YZ by Texas Instruments is a cellphone IC with 28 terminals in a rectangular grid array package. Operating at temperatures from -40 to 85°C, it features CMOS technology and RF/baseband circuitry for telecom applications. With a thin profile of 0.652mm, it supports power supplies of 2.5/3.3V for industrial-grade performance.

Median Price

$6.350

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 312 parts In-Stock

1+ parts

-

100+ parts

$6.350

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312

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$6.350

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Rochester

USA . 277 parts In-Stock

1+ parts

-

100+ parts

$5.500

1k+ parts

$4.920

10k+ parts

$4.630

277

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$5.500

$4.920

$4.630

Verical

USA . 277 parts In-Stock

1+ parts

-

100+ parts

$6.875

1k+ parts

$6.150

10k+ parts

$5.787

277

-

$6.875

$6.150

$5.787

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,150 parts In-Stock

1+ parts

$5.804

100+ parts

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1,150

$5.804

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TEDSS.com

USA . 333 parts In-Stock

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$10.000

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333

$10.000

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Vyrian

USA . 6,039 parts In-Stock

1+ parts

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6,039

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DigiKey Marketplace

USA . 312 parts In-Stock

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312

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Cogito LLC

Ukraine . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,509 parts In-Stock

1+ parts

$5.499

100+ parts

-

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2,509

$5.499

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Parana Technologies

USA . 1,305 parts In-Stock

1+ parts

$8.690

100+ parts

-

1k+ parts

$9.369

10k+ parts

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1,305

$8.690

-

$9.369

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Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$9.401

100+ parts

$9.307

1k+ parts

$8.931

10k+ parts

-

300

$9.401

$9.307

$8.931

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DigiPath Technology Company

USA . 552 parts In-Stock

1+ parts

$9.569

100+ parts

$8.803

1k+ parts

-

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552

$9.569

$8.803

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IDEA Electronic Components Group

UK . 1,930 parts In-Stock

1+ parts

$9.764

100+ parts

$9.276

1k+ parts

$8.788

10k+ parts

-

1,930

$9.764

$9.276

$8.788

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ChromeModa Solutions

Germany . 799 parts In-Stock

1+ parts

$9.764

100+ parts

$8.006

1k+ parts

-

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799

$9.764

$8.006

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Northwest PG Solutions

USA . 2,094 parts In-Stock

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$4.622

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2,094

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$4.622

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Native Components

USA . 784 parts In-Stock

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$4.574

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784

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$4.574

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Overview

Elevate your cellphone performance with the CC1000YZ by Texas Instruments, a cutting-edge RF and baseband circuit that promises unparalleled quality and reliability. Manufactured with precision using advanced CMOS technology, this Telecom IC offers seamless integration and optimized functionality for your device. With a compact design and versatile features, this product is perfect for a wide range of applications. Experience the difference with Texas Instruments and unlock the full potential of your cellphone with the CC1000YZ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the IC, making it suitable for long-term use in various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort during manufacturing.

Power Supplies (V): 2.5/3.3

Dual power supply options of 2.5V and 3.3V offer flexibility in design and compatibility with different system requirements.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options for various functions and connections within a cellphone system.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch allows for high-density mounting and efficient use of space on the PCB.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand heat and perform reliably in demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the IC can function effectively in cold environments without any issues.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB layout and assembly, making it easier to integrate the IC into the circuit design.

Width: 2.339 mm

A compact width of 2.339mm allows for space-efficient placement on the PCB and enables a streamlined design for the cellphone.

Length: 4.034 mm

The moderate length of 4.034mm strikes a balance between space-saving design and accommodating the necessary functionalities of the IC.

Temperature Grade: INDUSTRIAL

Having an industrial temperature grade ensures the IC can perform reliably in rugged industrial environments with varying temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of digital circuits, making it an efficient choice for cellphone applications.

Terminal Form: BALL

Ball terminal form provides reliable connections and efficient heat dissipation, contributing to the overall performance and longevity of the IC.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Being designed for RF and baseband circuit applications, this IC is optimized for efficient communication and signal processing in cellphone systems.

Nominal Supply Voltage: 3 V

A stable nominal supply voltage of 3V ensures consistent and reliable power delivery to the IC for optimal performance and functionality.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5mm enables high-density mounting and precise connections, enhancing the overall performance and reliability of the IC.

Technical Specifications

Cellphone ICs CC1000YZ attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-B28

Length:

4.034 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA28,4X7,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.652 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

2.339 mm

Trade Compliance

CC1000YZ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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