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TCM8000FR

Texas Instruments

TCM8000FR by Texas Instruments

Texas Instruments TCM8000FR is a Cellphone IC with BICMOS technology, 44 terminals in a square package. Operating temp range -25 to 80°C, suitable for baseband circuits. Package style: flatpack, terminal form: gull wing, and nominal voltage of 5V make it ideal for telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,643 parts In-Stock

1+ parts

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4,643

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Vyrian

USA . 3,413 parts In-Stock

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3,413

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,250 parts In-Stock

1+ parts

$12.755

100+ parts

-

1k+ parts

$13.221

10k+ parts

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2,250

$12.755

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$13.221

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AZTECH Wire

Italy . 383 parts In-Stock

1+ parts

$13.171

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383

$13.171

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DigiPath Technology Company

USA . 1,540 parts In-Stock

1+ parts

$14.045

100+ parts

$12.922

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1,540

$14.045

$12.922

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ChromeModa Solutions

Germany . 5,446 parts In-Stock

1+ parts

$14.332

100+ parts

$11.752

1k+ parts

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5,446

$14.332

$11.752

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IDEA Electronic Components Group

UK . 1,913 parts In-Stock

1+ parts

$14.332

100+ parts

$13.615

1k+ parts

$12.899

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1,913

$14.332

$13.615

$12.899

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One Stop Electronics

USA . 1,334 parts In-Stock

1+ parts

$177.000

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1,334

$177.000

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Semicontronic

India . 285 parts In-Stock

1+ parts

$234.000

100+ parts

$228.150

1k+ parts

$226.980

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285

$234.000

$228.150

$226.980

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Ampacity Inc.

Singapore . 682 parts In-Stock

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$284.000

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682

$284.000

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Corphita

USA . 778 parts In-Stock

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778

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Corohmni

South Africa . 322 parts In-Stock

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322

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Overview

Upgrade your cellphone experience with the TCM8000FR by Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers top-notch Cellphone ICs that guarantee superior performance and reliability. The TCM8000FR is a game-changer in the industry, offering seamless integration, advanced technology, and exceptional functionality. Elevate your mobile device with this cutting-edge telecom IC that promises to enhance your connectivity and communication. Trust Texas Instruments to deliver excellence in every aspect of your cellphone experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easier to handle and less prone to damage.

Surface Mount: YES

Surface mount technology allows for easy assembly and space-saving design, making the product suitable for compact devices.

Package Shape: SQUARE

Square package shape provides a uniform and efficient layout for the components inside, optimizing space usage.

No. of Terminals: 44

Having 44 terminals allows for greater connectivity options and functionality in the device.

Package Style (Meter): FLATPACK

Flatpack package style offers a low profile design, ideal for slim devices and efficient heat dissipation.

Maximum Operating Temperature: 80 °C

With a maximum operating temperature of 80°C, the product can withstand high temperature environments without compromising performance.

Minimum Operating Temperature: -25 °C

The product can operate efficiently in cold environments with a minimum operating temperature of -25°C.

Terminal Position: QUAD

Quad terminal position enhances stability and reliability of connections, ensuring consistent performance.

Maximum Seated Height: 2.25 mm

Low seated height of 2.25 mm makes the product suitable for thin and compact device designs.

Width: 10 mm

Compact width of 10 mm allows for efficient use of space and integration into smaller devices.

Length: 10 mm

Short length of 10 mm contributes to a space-saving design, fitting well in compact gadgets.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures reliable performance in a wide range of operating conditions, making the product versatile.

Technology: BICMOS

BiCMOS technology offers a balance of high-speed operation and low power consumption, making the product efficient and powerful.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and ease of soldering during assembly, ensuring durability and stability.

Telecom IC Type: BASEBAND CIRCUIT

Baseband circuit is essential for processing signals in telecommunications, making the product suitable for communication devices.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V is a standard requirement for many electronic devices, ensuring compatibility with various systems.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8 mm enables dense packaging of components, allowing for a high level of functionality in a small space.

Technical Specifications

Cellphone ICs TCM8000FR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

2.25 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

TCM8000FR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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