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TCM8010-37FR

Texas Instruments

TCM8010-37FR by Texas Instruments

Texas Instruments TCM8010-37FR is a Cellphone IC with 44 terminals in a square package. Operating at -30 to 70°C, it has a supply voltage of 3.7/4V and BICMOS technology. Ideal for baseband circuits, this IC is surface mountable and features GULL WING terminals in a flatpack style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,654 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

5,654

-

-

-

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Digiode

USA . 3,642 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,642

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,197 parts In-Stock

1+ parts

$11.775

100+ parts

-

1k+ parts

$12.176

10k+ parts

-

1,197

$11.775

-

$12.176

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IDEA Electronic Components Group

UK . 1,768 parts In-Stock

1+ parts

$13.230

100+ parts

$12.568

1k+ parts

$11.907

10k+ parts

-

1,768

$13.230

$12.568

$11.907

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ChromeModa Solutions

Germany . 887 parts In-Stock

1+ parts

$13.230

100+ parts

$10.849

1k+ parts

-

10k+ parts

-

887

$13.230

$10.849

-

-

AZTECH Wire

Italy . 368 parts In-Stock

1+ parts

$18.213

100+ parts

-

1k+ parts

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10k+ parts

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368

$18.213

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-

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One Stop Electronics

USA . 1,541 parts In-Stock

1+ parts

$934.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,541

$934.000

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-

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Corphita

USA . 3,894 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,894

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DigiPath Technology Company

USA . 2,069 parts In-Stock

1+ parts

-

100+ parts

$11.928

1k+ parts

-

10k+ parts

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2,069

-

$11.928

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Overview

Enhance the performance of your mobile devices with the TCM8010-37FR by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge Cellphone ICs that are designed to optimize efficiency and functionality. This versatile component offers a wide range of applications in the telecommunications industry, providing seamless integration and superior performance. With its advanced technology and innovative features, the TCM8010-37FR is the perfect solution for enhancing the capabilities of your devices, offering unparalleled value and benefits to customers seeking high-quality components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the IC, making it suitable for long-term use.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto circuit boards, saving time and labor costs.

Power Supplies (V): 3.7/4

Can operate within a range of 3.7V to 4V, providing flexibility in power supply options.

Package Shape: SQUARE

Square package shape helps in efficient space utilization on the circuit board.

No. of Terminals: 44

Having 44 terminals allows for complex connections and functionalities to be implemented.

Maximum Operating Temperature: 70 °C

Can operate at relatively high temperatures of up to 70°C without performance degradation.

Minimum Operating Temperature: -30 °C

Can withstand low temperatures down to -30°C, making it suitable for various operating environments.

Terminal Position: QUAD

Quad terminal position enables stable and secure connection within the circuit.

Width: 10 mm

Compact width of 10 mm allows for space-efficient integration into electronic devices.

Length: 10 mm

Compact length of 10 mm contributes to the overall small footprint of the IC.

Technology: BICMOS

Utilizing BICMOS technology offers the advantages of both bipolar and CMOS technologies for improved performance and efficiency.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections during assembly and operation.

Telecom IC Type: BASEBAND CIRCUIT

Being a baseband circuit IC, it is designed for processing signals directly from the transmission medium, making it ideal for telecom applications.

Nominal Supply Voltage: 4 V

Stable nominal supply voltage of 4V ensures consistent performance of the IC.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8 mm allows for high-density mounting and intricate circuit designs.

Technical Specifications

Cellphone ICs TCM8010-37FR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.5SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.7/4

Qualification:

Not Qualified

Maximum Seated Height:

2.25 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

4 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

TCM8010-37FR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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