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TCM8000FN

Texas Instruments

TCM8000FN by Texas Instruments

Texas Instruments TCM8000FN is a Cellphone IC with BICMOS technology. It features 44 terminals in a square chip carrier package, suitable for baseband circuit applications. Operating temperature ranges from -25°C to 80°C, making it ideal for commercial extended telecom use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,379 parts In-Stock

1+ parts

-

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6,379

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Digiode

USA . 4,415 parts In-Stock

1+ parts

-

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-

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4,415

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,857 parts In-Stock

1+ parts

$8.731

100+ parts

-

1k+ parts

$9.412

10k+ parts

-

1,857

$8.731

-

$9.412

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IDEA Electronic Components Group

UK . 1,224 parts In-Stock

1+ parts

$9.810

100+ parts

$9.320

1k+ parts

$8.829

10k+ parts

-

1,224

$9.810

$9.320

$8.829

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ChromeModa Solutions

Germany . 789 parts In-Stock

1+ parts

$9.810

100+ parts

$8.044

1k+ parts

-

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789

$9.810

$8.044

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AZTECH Wire

Italy . 251 parts In-Stock

1+ parts

$10.368

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251

$10.368

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One Stop Electronics

USA . 1,040 parts In-Stock

1+ parts

$642.000

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1,040

$642.000

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Corphita

USA . 3,914 parts In-Stock

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3,914

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DigiPath Technology Company

USA . 1,672 parts In-Stock

1+ parts

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100+ parts

$8.845

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1,672

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$8.845

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Overview

Unlock the full potential of your cellphone with the Texas Instruments TCM8000FN. Crafted with precision and expertise, this innovative Cellphone IC offers unmatched quality and reliability. From enhancing signal strength to optimizing battery life, this powerful component is designed to elevate your mobile experience. Experience seamless connectivity and superior performance with the TCM8000FN by Texas Instruments. Elevate your communication game today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good thermal conductivity and insulation properties, which helps in maintaining the proper functioning of the IC.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the IC onto a circuit board, saving space and reducing manufacturing costs.

No. of Terminals: 44

Having 44 terminals enables the IC to have multiple input and output connections, allowing for more complex functionalities in a cellphone.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption, making it a great choice for cellphones.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard voltage levels in cellphones, making integration easier.

Technical Specifications

Cellphone ICs TCM8000FN attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16.5862 mm

Trade Compliance

TCM8000FN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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