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ADF4360-2BCPZRL

Analog Devices

ADF4360-2BCPZRL by Analog Devices

Analog Devices' ADF4360-2BCPZRL is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features a 3.3V supply, BICMOS technology, and matte tin finish. This square chip carrier is ideal for baseband circuits in industrial telecom applications due to its compact size and low profile design.

Median Price

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Lifecycle Status

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6

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1k+

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VNN

France . 5,380 parts In-Stock

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Vyrian

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Nova Conductors

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Digiode

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Connector Distribution Corp

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Right Parts Inc.

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Corohmni

South Africa . 299 parts In-Stock

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$6.248

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AZTECH Wire

Italy . 230 parts In-Stock

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Parana Technologies

USA . 5 parts In-Stock

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$11.535

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$10.727

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IDEA Electronic Components Group

UK . 219 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,568 parts In-Stock

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DigiPath Technology Company

USA . 2,102 parts In-Stock

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Ampacity Inc.

Singapore . 1,488 parts In-Stock

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Semicontronic

India . 575 parts In-Stock

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One Stop Electronics

USA . 1,025 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Corphita

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Bastille Electronics

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Overview

Enhance your cellphone's performance with the ADF4360-2BCPZRL by Analog Devices. As a trusted manufacturer in the industry of Cellphone ICs, Analog Devices delivers top-quality products that are designed to optimize your device's functionality. With its compact square package shape and advanced BICMOS technology, this IC offers exceptional value and benefits for your mobile device. From baseband circuits to telecommunications applications, the ADF4360-2BCPZRL ensures reliability and efficiency, making it the ideal choice for customers looking to elevate their mobile experience.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Package Shape: SQUARE

Square package shape provides a compact footprint, optimizing space on the PCB and allowing for higher component density.

Power Supplies (V): 3.3

Operates at a standard power supply voltage of 3.3V, compatible with a wide range of systems and applications.

No. of Terminals: 24

Offers sufficient terminals for connectivity and interface requirements, enabling versatile functionality within the IC.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of chip carrier, heat sink/slug, and very thin profile package styles provide thermal management and space-saving benefits for improved reliability and performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in harsh environments and under demanding conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures functionality even in extreme cold conditions, making the IC suitable for diverse applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers good solderability and corrosion resistance, enhancing the longevity and reliability of the IC.

Terminal Position: QUAD

Quad terminal positioning facilitates efficient integration and soldering on the PCB, streamlining the assembly process.

Maximum Seated Height: 1 mm

Low maximum seated height enables a compact design, contributing to space-saving benefits for the overall system.

Width: 4 mm

Narrow width dimension allows for a smaller form factor, ideal for applications where space constraints exist.

Peak Reflow Temperature °C: 260

Withstands high peak reflow temperatures, ensuring reliable solder joints during the assembly process.

Length: 4 mm

Compact length dimension contributes to the overall small footprint of the IC, optimizing space utilization on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade rating enables operation within a wide temperature range, suitable for industrial applications with varying environmental conditions.

Technology: BICMOS

Utilizes BiCMOS technology, combining the advantages of bipolar and CMOS technologies for improved speed, power efficiency, and performance.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations, reducing the environmental impact and ensuring safer handling and disposal.

Telecom IC Type: BASEBAND CIRCUIT

Baseband circuit type supports essential functions in telecom applications, ensuring reliable communication and signal processing capabilities within the IC.

Nominal Supply Voltage: 3.3 V

Operates at a stable nominal supply voltage of 3.3V, providing consistent and efficient power delivery for optimal performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm facilitates high-density mounting, enabling compact designs with minimal spacing between terminals.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring proper handling and storage to maintain the quality and reliability of the IC.

Technical Specifications

Cellphone ICs ADF4360-2BCPZRL attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

ADF4360-2BCPZRL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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