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HMC602LP4

Analog Devices

HMC602LP4 by Analog Devices

Analog Devices' HMC602LP4 is a cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.

Median Price

$21.275

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15 parts In-Stock

1+ parts

-

100+ parts

$19.710

1k+ parts

$17.640

10k+ parts

$16.600

15

-

$19.710

$17.640

$16.600

DigiKey

USA . 15 parts In-Stock

1+ parts

-

100+ parts

$22.840

1k+ parts

$22.840

10k+ parts

$22.840

15

-

$22.840

$22.840

$22.840

Distributors (In-Stock)

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Nova Conductors

Japan . 37 parts In-Stock

1+ parts

$19.580

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37

$19.580

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Digiode

USA . 554 parts In-Stock

1+ parts

$20.862

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554

$20.862

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Vyrian

USA . 5,273 parts In-Stock

1+ parts

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5,273

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Prism Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,905 parts In-Stock

1+ parts

$15.368

100+ parts

-

1k+ parts

$14.292

10k+ parts

-

1,905

$15.368

-

$14.292

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IDEA Electronic Components Group

UK . 1,364 parts In-Stock

1+ parts

$16.525

100+ parts

$15.699

1k+ parts

$15.699

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-

1,364

$16.525

$15.699

$15.699

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AZTECH Wire

Italy . 663 parts In-Stock

1+ parts

$18.322

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663

$18.322

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Ampacity Inc.

Singapore . 15 parts In-Stock

1+ parts

$18.670

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15

$18.670

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Semicontronic

India . 15 parts In-Stock

1+ parts

$18.670

100+ parts

$18.203

1k+ parts

$18.110

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-

15

$18.670

$18.203

$18.110

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Corphita

USA . 991 parts In-Stock

1+ parts

$19.764

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991

$19.764

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DigiPath Technology Company

USA . 922 parts In-Stock

1+ parts

$25.779

100+ parts

$24.748

1k+ parts

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$24.748

922

$25.779

$24.748

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$24.748

Lixinc

USA . 7,313 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Elevate your cellphone performance with the HMC602LP4 by Analog Devices. Known for their top-notch quality and reliable products, Analog Devices brings you a cutting-edge Cellphone IC that promises seamless functionality and optimal performance. Whether you're looking to enhance your smartphone's RF and baseband circuit or improve overall signal processing, this versatile chip carrier is designed to meet all your needs. Say goodbye to connectivity issues and hello to unparalleled efficiency with the HMC602LP4. Upgrade your device today and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and resilience, making it a reliable choice.

Surface Mount: YES

Facilitates easy installation and saves space on the circuit board, increasing efficiency.

Package Shape: SQUARE

Offers a symmetrical design that enhances uniformity in assembly, improving overall performance.

No. of Terminals: 24

Provides ample connection points for various functionalities, adding versatility to the product.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This style combination optimizes heat dissipation and compactness, enhancing functionality in limited spaces.

Maximum Operating Temperature: 85 °C

Ensures stability and reliability even under high-temperature conditions, increasing longevity.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold environments, making it suitable for a wide range of applications.

Terminal Finish: TIN LEAD

Enhances conductivity and durability, ensuring consistent performance over time.

Terminal Position: QUAD

Quad positioning allows efficient routing of connections, improving overall signal integrity.

Maximum Seated Height: 1 mm

Low profile design saves space and allows for sleek and compact device designs.

Width: 4 mm

Narrow width enables a space-saving layout, ideal for applications with limited board space.

Length: 4 mm

Compact length facilitates flexible placement on the circuit board, enabling versatile integration.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable operation in demanding conditions.

Terminal Form: NO LEAD

Lead-free terminals adhere to modern regulations and environmental standards, making it a sustainable choice.

Telecom IC Type: RF AND BASEBAND CIRCUIT

A combination of RF and baseband circuits enables comprehensive communication capabilities, enhancing functionality.

Nominal Supply Voltage: 5 V

5V supply ensures compatibility with standard power sources, making integration seamless.

Terminal Pitch: 0.5 mm

Fine pitch spacing allows for high-density mounting, enabling intricate circuit designs in compact devices.

Technical Specifications

Cellphone ICs HMC602LP4 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

HMC602LP4 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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