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ADF7020BCPZ

Analog Devices

ADF7020BCPZ by Analog Devices

Analog Devices' ADF7020BCPZ is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 3V, RF and baseband circuitry, and a terminal pitch of 0.5mm. Ideal for telecom applications requiring industrial temperature grade performance in a compact square package.

Median Price

$4.810

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 1 parts In-Stock

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$0.756

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1

$0.756

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Chip1Stop

Japan . 520 parts In-Stock

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$4.810

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$3.660

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$3.440

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520

$4.810

$3.660

$3.440

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Mouser Electronics

USA . 207 parts In-Stock

1+ parts

$7.020

100+ parts

$5.070

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$4.590

10k+ parts

$4.510

207

$7.020

$5.070

$4.590

$4.510

Verical

USA . 179 parts In-Stock

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$5.150

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$5.150

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Rochester

USA . 37 parts In-Stock

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$3.870

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$3.460

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$3.260

37

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$3.870

$3.460

$3.260

Distributors (In-Stock)

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DF Sales Co.

USA . 40 parts In-Stock

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$2.380

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40

$2.380

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DF Sales Co.

USA . 40 parts In-Stock

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$2.380

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40

$2.380

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Digiode

USA . 196 parts In-Stock

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$3.258

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$3.258

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Nova Conductors

Japan . 61 parts In-Stock

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$4.215

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$4.215

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Chip Stock

USA . 4,500 parts In-Stock

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4,500

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VNN

France . 782 parts In-Stock

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PC Components Company LLC

USA . 312 parts In-Stock

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NexGen Digital

USA . 91 parts In-Stock

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Vyrian

USA . 60 parts In-Stock

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Cyclops Electronics Ltd

UK . 52 parts In-Stock

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Bristol Electronics

USA . 3 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 246 parts In-Stock

1+ parts

$2.920

100+ parts

$2.847

1k+ parts

$2.832

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246

$2.920

$2.847

$2.832

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Ampacity Inc.

Singapore . 222 parts In-Stock

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$2.920

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222

$2.920

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Corphita

USA . 9 parts In-Stock

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$3.087

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9

$3.087

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Bastille Electronics

Australia . 700 parts In-Stock

1+ parts

$4.215

100+ parts

$4.004

1k+ parts

$3.804

10k+ parts

$3.751

700

$4.215

$4.004

$3.804

$3.751

Argo Parts USA

USA . 2,227 parts In-Stock

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$4.215

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2,227

$4.215

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Continental Prestige Electronics

USA . 260 parts In-Stock

1+ parts

$5.300

100+ parts

$4.180

1k+ parts

$3.190

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260

$5.300

$4.180

$3.190

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Parana Technologies

USA . 291 parts In-Stock

1+ parts

$5.628

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$5.234

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291

$5.628

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$5.234

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IDEA Electronic Components Group

UK . 323 parts In-Stock

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$6.052

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$5.749

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323

$6.052

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$5.749

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Corohmni

South Africa . 1,001 parts In-Stock

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$7.578

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$7.578

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DigiPath Technology Company

USA . 1,644 parts In-Stock

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$9.441

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$9.063

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1,644

$9.441

$9.063

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Aztec Data Supply Inc.

USA . 160 parts In-Stock

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$9.650

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$9.650

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A-Z Elektronik GmbH

Germany . 12,600 parts In-Stock

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Perfect Parts

USA . 8,981 parts In-Stock

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RC Electronics

USA . 7,681 parts In-Stock

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Lixinc

USA . 6,914 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Glotronic Ltd.

UK . 3,300 parts In-Stock

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Kepictronics

USA . 2,612 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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GreenTree Electronics

Israel . 52 parts In-Stock

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Overview

Elevate your cellphone designs with the ADF7020BCPZ by Analog Devices. Known for their superior quality and reliability, Analog Devices delivers cutting-edge solutions in the telecom IC category. This surface mount package boasts a sleek square shape and a very thin profile, making it ideal for compact devices. With a nominal supply voltage of 3V and an industrial temperature grade, this RF and baseband circuit ensures optimal performance in any environment. Experience the unmatched value and benefits that the ADF7020BCPZ brings to your next project. Elevate your designs with Analog Devices.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy installation and replacement of the product, making it convenient for users.

Package Shape: SQUARE

The square shape provides a compact design, allowing for efficient use of space on circuit boards.

Power Supplies (V): 2.5/3.3

The dual power supply options offer flexibility and compatibility with various devices and systems.

No. of Terminals: 48

With a high number of terminals, this product can accommodate complex circuit connections and functions.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

These package styles offer thermal management and space-saving benefits for improved performance.

Maximum Operating Temperature: 85 °C

This high operating temperature range ensures reliability and stability even under demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature extends the product's versatility for use in diverse environments.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and enhances solderability for long-lasting performance.

Terminal Position: QUAD

The quad terminal position facilitates efficient signal transmission and connectivity within the circuit.

Maximum Seated Height: 1 mm

The low seated height enables a compact design, ideal for space-constrained applications.

Width: 7 mm

This moderate width allows for versatility in placement and integration with other components on the board.

Maximum Time At Peak Reflow Temperature (s): 40

The short time at peak reflow temperature speeds up the manufacturing process without compromising quality.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and thermal bonding for a reliable connection.

Length: 7 mm

The moderate length offers a balanced size for compatibility with various board layouts and configurations.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates durable performance in harsh operating conditions and environments.

Terminal Form: NO LEAD

The lead-free terminal form complies with environmental regulations and reduces the risk of harmful substances.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The inclusion of RF and baseband circuit types enables comprehensive telecommunication capabilities for the product.

Nominal Supply Voltage: 3 V

The standard 3V supply voltage provides consistent power for efficient operation of the product.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density integration and precise connections on the circuit board.

Moisture Sensitivity Level (MSL): 3

The moderate moisture sensitivity level ensures reliability during storage and manufacturing processes.

Technical Specifications

Cellphone ICs ADF7020BCPZ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Trade Compliance

ADF7020BCPZ Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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