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ADF7021-VBCPZ-RL

Analog Devices

ADF7021-VBCPZ-RL by Analog Devices

Analog Devices' ADF7021-VBCPZ-RL is a cellphone IC with 48 terminals in a square chip carrier package. It operates at -40 to 85 °C, with a supply voltage of 3V. Ideal for RF and baseband circuits, it has a terminal pitch of 0.5mm and is suitable for industrial temperature grades.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,246 parts In-Stock

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Digiode

USA . 218 parts In-Stock

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Native Components

USA . 228 parts In-Stock

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$0.539

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$0.539

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Northwest PG Solutions

USA . 436 parts In-Stock

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$0.593

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Parana Technologies

USA . 34 parts In-Stock

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$16.386

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$15.239

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IDEA Electronic Components Group

UK . 1,572 parts In-Stock

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$17.619

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$16.738

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$16.738

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AZTECH Wire

Italy . 552 parts In-Stock

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$19.232

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DigiPath Technology Company

USA . 951 parts In-Stock

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$27.486

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$26.386

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$26.386

951

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$26.386

Component Stockers USA

USA . 774 parts In-Stock

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$89.320

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One Stop Electronics

USA . 1,255 parts In-Stock

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$578.000

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Semicontronic

India . 186 parts In-Stock

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$710.000

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$692.250

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$688.700

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QUARKTWIN TECHNOLOGY LTD

USA . 10,289 parts In-Stock

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Corphita

USA . 367 parts In-Stock

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Robosynatics

Brazil . 250 parts In-Stock

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Lucentia Tech

USA . 250 parts In-Stock

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$10.490

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$9.714

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$9.714

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$10.490

$9.714

$9.714

Overview

Elevate your cellphone's performance with the ADF7021-VBCPZ-RL by Analog Devices. Manufactured with precision and expertise, this RF and baseband circuit IC offers unparalleled reliability and quality. Suitable for a wide range of applications, this product guarantees seamless connectivity and optimal functionality. With its innovative design and advanced features, customers can expect exceptional value and benefits. Upgrade your device today with the ADF7021-VBCPZ-RL and experience the difference.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, making the product more cost-effective and reliable.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages provides flexibility for different system requirements, making the product versatile and compatible with various applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles helps in efficient thermal management and space-saving, enhancing the overall performance and compactness of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand rigorous usage conditions, ensuring reliability and longevity in demanding environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, contributing to the product's durability and performance during soldering processes.

Technical Specifications

Cellphone ICs ADF7021-VBCPZ-RL attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

ADF7021-VBCPZ-RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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