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ADRF6603ACPZ-R7

Analog Devices

ADRF6603ACPZ-R7 by Analog Devices

Analog Devices' ADRF6603ACPZ-R7 is a 40-terminal cellphone IC with BICMOS technology. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.

Median Price

$11.720

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,892 parts In-Stock

1+ parts

-

100+ parts

$10.860

1k+ parts

$9.720

10k+ parts

$9.140

9,892

-

$10.860

$9.720

$9.140

DigiKey

USA . 9,892 parts In-Stock

1+ parts

-

100+ parts

$12.580

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-

10k+ parts

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9,892

-

$12.580

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 437 parts In-Stock

1+ parts

$11.495

100+ parts

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437

$11.495

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Vyrian

USA . 689 parts In-Stock

1+ parts

$12.100

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-

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689

$12.100

-

-

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ACDS - Activité Composants Distribution Service

France . 318 parts In-Stock

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318

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Distributors (Availability)

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Native Components

USA . 958 parts In-Stock

1+ parts

$1.525

100+ parts

-

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958

$1.525

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Northwest PG Solutions

USA . 280 parts In-Stock

1+ parts

$1.677

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-

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280

$1.677

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Parana Technologies

USA . 764 parts In-Stock

1+ parts

$9.517

100+ parts

-

1k+ parts

$8.851

10k+ parts

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764

$9.517

-

$8.851

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IDEA Electronic Components Group

UK . 640 parts In-Stock

1+ parts

$10.233

100+ parts

-

1k+ parts

$9.721

10k+ parts

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640

$10.233

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$9.721

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Corphita

USA . 949 parts In-Stock

1+ parts

$10.890

100+ parts

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949

$10.890

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DigiPath Technology Company

USA . 1,859 parts In-Stock

1+ parts

$15.963

100+ parts

$15.325

1k+ parts

-

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$15.325

1,859

$15.963

$15.325

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$15.325

QUARKTWIN TECHNOLOGY LTD

USA . 20,934 parts In-Stock

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20,934

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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A-Z Elektronik GmbH

Germany . 4,500 parts In-Stock

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4,500

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Perfect Parts

USA . 2,381 parts In-Stock

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2,381

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RC Electronics

USA . 2,188 parts In-Stock

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2,188

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Assy Fe

Spain . 1,413 parts In-Stock

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1,413

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Metaverse IC Inc.

Canada . 640 parts In-Stock

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640

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Kepictronics

USA . 540 parts In-Stock

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540

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Cyclops Electronics Ltd (Excess)

UK . 318 parts In-Stock

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318

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ChipstoGo Electronic ltd

UK . 16 parts In-Stock

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16

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Overview

Elevate your cellphone performance with the ADRF6603ACPZ-R7 by Analog Devices, a leading manufacturer known for top-quality products. This Cellphone IC is designed to maximize efficiency and enhance user experience, making it a must-have for cutting-edge mobile devices. With its surface mount capability and industrial-grade technology, this chip carrier offers unparalleled reliability and durability. Trust Analog Devices to deliver innovation and excellence in every application of this RF and baseband circuit, providing customers with the ultimate value and benefits in telecommunications technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and reliable installation on printed circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

The square package shape helps in efficient use of board space and enables easy alignment during assembly.

No. of Terminals: 40

Having 40 terminals provides ample connectivity options for various functions within the cellphone IC, allowing for flexibility in design and functionality.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand elevated temperatures without compromising performance or reliability.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures that the cellphone IC remains functional in a wide range of environmental conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers excellent solderability and corrosion resistance, ensuring reliable connections and long-term performance.

Terminal Position: QUAD

The quad terminal position design facilitates easy soldering and secure connectivity, enhancing the overall reliability of the cellphone IC.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm enables a compact design and efficient use of space within the cellphone IC assembly.

Width: 6 mm

With a width of 6mm, this cellphone IC is suitable for applications requiring a compact form factor without compromising on performance.

Length: 6 mm

The 6mm length provides a balanced footprint for the cellphone IC, making it versatile and compatible with various board layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the cellphone IC can operate reliably in harsh industrial environments, making it suitable for diverse applications.

Technology: BICMOS

Utilizing BiCMOS technology offers a blend of high-speed performance and low power consumption, making this cellphone IC efficient and reliable for demanding applications.

Terminal Form: NO LEAD

The no-lead terminal form enhances the reliability and longevity of the cellphone IC by reducing the risk of solder joint cracks and failures.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuit functionality in a single package enables seamless communication and processing within the cellphone IC, optimizing performance and signal integrity.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V allows this cellphone IC to be compatible with standard power sources and ensures reliable performance under normal operating conditions.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch provides fine pitch connections, enabling high-density integration of components and signals within the cellphone IC for enhanced functionality.

Technical Specifications

Cellphone ICs ADRF6603ACPZ-R7 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e3

Length:

6 mm

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

ADRF6603ACPZ-R7 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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