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HMC686LP4

Analog Devices

HMC686LP4 by Analog Devices

Analog Devices' HMC686LP4 is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial telecom applications. The RF and baseband circuit has a nominal voltage of 5V, making it ideal for surface mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,601 parts In-Stock

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7,601

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Digiode

USA . 972 parts In-Stock

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972

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Distributors (Availability)

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Parana Technologies

USA . 916 parts In-Stock

1+ parts

$7.571

100+ parts

-

1k+ parts

$7.041

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916

$7.571

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$7.041

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IDEA Electronic Components Group

UK . 1,664 parts In-Stock

1+ parts

$8.141

100+ parts

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$7.734

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1,664

$8.141

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$7.734

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DigiPath Technology Company

USA . 1,862 parts In-Stock

1+ parts

$12.700

100+ parts

$12.192

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$12.192

1,862

$12.700

$12.192

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$12.192

AZTECH Wire

Italy . 198 parts In-Stock

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$13.330

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198

$13.330

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One Stop Electronics

USA . 582 parts In-Stock

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$730.000

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582

$730.000

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Semicontronic

India . 134 parts In-Stock

1+ parts

$912.000

100+ parts

$889.200

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$884.640

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134

$912.000

$889.200

$884.640

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Corphita

USA . 942 parts In-Stock

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942

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Overview

Enhance your cellphone's performance with the HMC686LP4 by Analog Devices. Crafted with precision and expertise, this RF and baseband circuit offers unparalleled reliability and efficiency, making it a top choice for telecom applications. The advanced BICMOS technology ensures seamless integration and optimal functionality, while the industrial-grade temperature rating guarantees durability in any environment. Trust Analog Devices to deliver cutting-edge solutions that elevate your devices to new heights of performance. Elevate your cellphone experience with the HMC686LP4 – where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic body material provides durability and lightweight design, making the product suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, reducing production costs.

Package Shape: SQUARE

Square package shape provides a compact footprint, optimizing space on the circuit board.

No. of Terminals: 24

Having 24 terminals allows for multiple connections and functionalities within the IC, enhancing overall performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the IC can withstand harsh environmental conditions without compromising functionality.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments, increasing versatility of the product.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and conductivity, ensuring reliable connections.

Terminal Position: QUAD

Quad terminal position allows for efficient routing of signals, reducing signal interference and improving performance.

Maximum Seated Height: 1 mm

Low maximum seated height makes the IC suitable for slim and compact devices, enhancing design flexibility.

Width: 4 mm

Compact width size allows for space-saving integration on PCBs, especially in tight layout designs.

Length: 4 mm

Short length dimension further contributes to the compact form factor of the IC, suitable for small electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating conditions commonly found in industrial environments.

Technology: BICMOS

BICMOS technology combines the advantages of Bipolar and CMOS technologies, offering high-speed operation and low power consumption.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and provides a more eco-friendly option for electronic products.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuit in a single IC offers integrated functionality for better performance and optimized signal processing.

Nominal Supply Voltage: 5 V

5V nominal supply voltage is commonly used in electronic devices, ensuring compatibility with existing power systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting on PCBs, enabling more functionalities within limited space.

Technical Specifications

Cellphone ICs HMC686LP4 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

HMC686LP4 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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