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MAX2674EWT+T

Analog Devices

MAX2674EWT+T by Analog Devices

MAX2674EWT+T by Analog Devices is a Cellphone IC with BICMOS tech, 3.3V supply voltage, and RF/Baseband circuit type. It has a temp range of -40 to 85°C, package style GRID ARRAY, and terminal finish of TIN SILVER COPPER NICKEL. Ideal for telecom applications requiring high performance in a compact form factor.

Median Price

$3.180

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

MAX2674EWT+T by Analog Devices
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 919 parts In-Stock

1+ parts

$1.702

100+ parts

-

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-

10k+ parts

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919

$1.702

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Analog Devices Inc

USA . 75,303 parts In-Stock

1+ parts

$3.710

100+ parts

$2.791

1k+ parts

$2.447

10k+ parts

$2.328

75,303

$3.710

$2.791

$2.447

$2.328

DigiKey

USA . 1,515 parts In-Stock

1+ parts

$4.290

100+ parts

$3.227

1k+ parts

$2.832

10k+ parts

$2.695

1,515

$4.290

$3.227

$2.832

$2.695

Mouser Electronics

USA . 1,375 parts In-Stock

1+ parts

$4.290

100+ parts

$2.780

1k+ parts

$2.460

10k+ parts

$2.410

1,375

$4.290

$2.780

$2.460

$2.410

Farnell

UK . 2,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$2.000

2,500

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-

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$2.000

Newark

USA . 2,500 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

$2.720

2,500

-

-

-

$2.720

Element14

Singapore . 2,500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

$3.640

2,500

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-

-

$3.640

Verical

USA . 919 parts In-Stock

1+ parts

-

100+ parts

$1.511

1k+ parts

$1.462

10k+ parts

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919

-

$1.511

$1.462

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mobius Materials

USA . 223 parts In-Stock

1+ parts

$1.730

100+ parts

$1.390

1k+ parts

-

10k+ parts

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223

$1.730

$1.390

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-

Digiode

USA . 2,226 parts In-Stock

1+ parts

$1.993

100+ parts

-

1k+ parts

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10k+ parts

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2,226

$1.993

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.455

100+ parts

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100

$2.455

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Chip Stock

USA . 31,740 parts In-Stock

1+ parts

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100+ parts

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31,740

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Anansix

USA . 1,901 parts In-Stock

1+ parts

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1,901

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Vyrian

USA . 1,427 parts In-Stock

1+ parts

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1,427

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Sensible Micro Corp

USA . 490 parts In-Stock

1+ parts

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490

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Prism Electronics

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,725 parts In-Stock

1+ parts

$1.640

100+ parts

-

1k+ parts

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10k+ parts

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1,725

$1.640

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-

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Semicontronic

India . 1,576 parts In-Stock

1+ parts

$1.640

100+ parts

$1.599

1k+ parts

$1.591

10k+ parts

-

1,576

$1.640

$1.599

$1.591

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Corphita

USA . 1,565 parts In-Stock

1+ parts

$1.888

100+ parts

-

1k+ parts

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10k+ parts

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1,565

$1.888

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MARBEL Systems

Belgium . 3,261 parts In-Stock

1+ parts

$11.559

100+ parts

-

1k+ parts

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10k+ parts

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3,261

$11.559

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Texas Native Microelectronics

USA . 1,461 parts In-Stock

1+ parts

$13.286

100+ parts

$12.755

1k+ parts

$12.356

10k+ parts

$11.692

1,461

$13.286

$12.755

$12.356

$11.692

Kenton Components

USA . 1,294 parts In-Stock

1+ parts

$15.943

100+ parts

-

1k+ parts

-

10k+ parts

$14.030

1,294

$15.943

-

-

$14.030

Qasali Group International

UK . 2,313 parts In-Stock

1+ parts

$35.872

100+ parts

-

1k+ parts

$33.361

10k+ parts

$31.568

2,313

$35.872

-

$33.361

$31.568

Perfect Parts

USA . 6,145 parts In-Stock

1+ parts

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6,145

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Netroflash

USA . 500 parts In-Stock

1+ parts

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100+ parts

$2.406

1k+ parts

$2.332

10k+ parts

$2.283

500

-

$2.406

$2.332

$2.283

Overview

Enhance the performance of your cellphone with the MAX2674EWT+T by Analog Devices. Known for their high-quality products, Analog Devices delivers top-notch cellphone ICs that are essential for optimal mobile device functionality. This RF and baseband circuit provides customers with reliable communication capabilities, ensuring seamless connectivity. With a temperature grade of industrial and a nominal supply voltage of 3.3V, this versatile IC is perfect for a wide range of applications. Trust Analog Devices to deliver superior technology that enhances your mobile experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are known for their durability and ability to withstand various environmental conditions, making this product suitable for long-term usage.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a circuit board, increasing manufacturing productivity.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact design, saving space on the circuit board and allowing for more components to be integrated.

No. of Terminals: 6

Having a higher number of terminals allows for more connectivity options and functionality within the cellphone IC, enhancing its overall performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the cellphone IC can function reliably even under demanding conditions, providing consistent performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature further showcases the versatility of the product, making it suitable for use in various climates and environments.

Terminal Finish: TIN SILVER COPPER NICKEL

The use of multiple materials for terminal finish ensures good conductivity, corrosion resistance, and overall reliability of the connections in the cellphone IC.

Terminal Position: BOTTOM

Bottom terminal position simplifies the mounting process and enhances electrical connections, improving overall performance and stability of the product.

Maximum Seated Height: 0.69 mm

The low maximum seated height allows for a slim profile design, making the cellphone IC suitable for compact devices without compromising on performance.

Width: 0.865 mm

The narrow width of the package facilitates close placement of components on the circuit board, optimizing space usage and allowing for efficient design layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The short time required at peak reflow temperature during assembly ensures minimal thermal stress on the components, resulting in a more reliable end product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature indicates the product's ability to withstand the soldering process without degrading, ensuring robust construction and long-term durability.

Length: 1.27 mm

The compact length of the package contributes to the overall small form factor of the cellphone IC, enabling integration into slim and portable devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies the reliability and stability of the product under extended operating conditions, making it suitable for industrial applications.

Technology: BICMOS

Utilizing Bipolar-CMOS technology combines the speed of bipolar transistors with the low power consumption of CMOS, resulting in efficient performance and energy savings.

Terminal Form: BALL

The ball terminal form provides a reliable electrical connection and facilitates easy soldering during assembly, ensuring secure and stable connections.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The inclusion of RF and baseband circuits in the cellphone IC enables seamless communication between different components, enhancing the overall functionality and performance.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage ensures compatibility with standard power sources, making integration into various systems straightforward and efficient.

Terminal Pitch: 0.4 mm

The tight terminal pitch allows for high-density mounting of components on the circuit board, maximizing space utilization and enabling complex designs within a small form factor.

Technical Specifications

Cellphone ICs MAX2674EWT+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PBGA-B6

JESD-609 Code:

e2

Length:

1.27 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.69 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER NICKEL

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.865 mm

Trade Compliance

MAX2674EWT+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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