Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Texas Instruments 1185 is a cellphone IC with CMOS technology, operating b/w -40 to 85°C. It features a 16-terminal chip carrier package with a 0.65mm terminal pitch. Ideal for RF and baseband circuits in industrial telecom applications due to its compact square shape and very thin profile design.
Median Price
$2.520
Lifecycle Status
Suppliers In-Stock
16
In-Stock Inventory
1k+
RS (Exports)
1+ parts
$0.040
100+ parts
-
1k+ parts
10k+ parts
RS Americas
$0.070
$0.066
$0.065
Mouser Electronics
$4.970
$2.960
DigiKey
$9.950
Verical
$77.068
Powell Electronics
$0.063
Digiode
$0.062
Nova Conductors
Rapid Electronics
$10.080
SOS electronic
$53.712
Vyrian
VNN
Jameco Electronics
Bisco
Lakeview Electronics
ACDS - Activité Composants Distribution Service
Semicontronic
$0.056
$0.055
$0.054
Corphita
$0.058
Continental Prestige Electronics
$9.751
Netroflash
$9.452
$9.253
Parana Technologies
$12.787
$13.253
IDEA Electronic Components Group
$14.367
$13.649
$12.930
Allen Electronics Distributors
$0.068
Futuretech Components
DigiPath Technology Company
$12.953
Aztec Data Supply Inc.
Argo Parts USA
Advanced Electronics
This material is commonly used in electronic components for its durability and heat-resistance, ensuring a reliable and long-lasting product.
Surface mount technology allows for a smaller form factor, improved thermal performance, and easier automated assembly, making the product more efficient.
The square shape of the package provides a compact design, saving space on the PCB and contributing to a sleek and modern device design.
Having 16 terminals allows for more connectivity options, enabling the IC to interface with various other components and peripherals for enhanced functionality.
With a high maximum operating temperature, the IC can withstand harsh environmental conditions and perform consistently even under extreme heat.
The low minimum operating temperature ensures that the IC remains functional even in cold environments, making it versatile for use in different climate conditions.
The quad terminal position allows for efficient routing of signals and power distribution, optimizing the performance of the IC and reducing interference.
CMOS technology offers low power consumption, high speed, and compatibility with various digital systems, making the IC energy-efficient and versatile for different applications.
Operating at a low nominal supply voltage of 3V, the IC consumes less power and generates less heat, contributing to the overall efficiency and longevity of the device.
Cellphone ICs 1185 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments
JESD-30 Code:
Length:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
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Qualification:
Maximum Seated Height:
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Technology:
Telecom IC Type:
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Width:
1185 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NSN
2020-01-365-6899, 2020013656899, 2640-14-365-6489, 2640143656489, 2940-15-002-7054, 2940150027054, 3030-00-062-8561, 3030000628561, 4030-99-792-0631, 4030997920631, 4210-14-473-7298, 4210144737298, 4240-33-202-1491, 4240332021491, 4240-15-140-0080, 4240151400080, 4510-00-567-5462, 4510005675462, 4720-01-149-9266, 4720011499266, 4730-00-142-2532, 4730001422532, 4730-17-109-3562, 4730171093562, 4820-00-918-8710, 4820009188710, 4930-15-139-6594, 4930151396594, 5120-01-399-9909, 5120013999909, 5120-99-138-9367, 5120991389367, 5120-15-134-4586, 5120151344586, 5305-14-209-5283, 5305142095283, 5310-00-406-9291, 5310004069291, 5325-14-031-2536, 5325140312536, 5330-99-813-6251, 5330998136251, 5340-14-240-8238, 5340142408238, 5340-14-368-9033, 5340143689033, 5355-00-061-3451, 5355000613451, 5355-14-254-8837, 5355142548837, 5805-00-505-0858, 5805005050858, 5930-00-195-9399, 5930001959399, 5930-01-232-0838, 5930012320838, 5935-00-283-2067, 5935002832067, 5935-01-346-2549, 5935013462549, 5940-00-964-4025, 5940009644025, 5961-00-442-9438, 5961004429438, 5975-14-420-7486, 5975144207486, 5998-25-120-4693, 5998251204693, 6130-13-113-0286, 6130131130286, 6145-00-184-6155, 6145001846155, 6260-22-100-0137, 6260221000137, 6320-22-258-2876, 6320222582876, 6250-99-808-1568, 6250998081568, 6505-01-284-5153, 6505012845153, 6510-99-435-6778, 6510994356778, 6515-01-292-6659, 6515012926659, 6515-01-551-6324, 6515015516324, 6515-01-139-8091, 6515011398091, 6520-01-330-5105, 6520013305105, 6530-33-189-7861, 6530331897861, 6625-14-373-2174, 6625143732174, 6645-00-177-4729, 6645001774729, 6675-12-129-9778, 6675121299778, 6685-00-618-1822, 6685006181822, 7210-21-877-0303, 7210218770303, 7320-14-239-0280, 7320142390280, 7420-01-049-8940, 7420010498940, 7520-98-202-8939, 7520982028939, 8140-01-589-0156, 8140015890156, 8415-99-000-5577, 8415990005577, 8415-99-130-7325, 8415991307325
NIIN
013656899, 143656489, 150027054, 000628561, 997920631, 144737298, 332021491, 151400080, 005675462, 011499266, 001422532, 171093562, 009188710, 151396594, 013999909, 991389367, 151344586, 142095283, 004069291, 140312536, 998136251, 142408238, 143689033, 000613451, 142548837, 005050858, 001959399, 012320838, 002832067, 013462549, 009644025, 004429438, 144207486, 251204693, 131130286, 001846155, 221000137, 222582876, 998081568, 012845153, 994356778, 012926659, 015516324, 011398091, 013305105, 331897861, 143732174, 001774729, 121299778, 006181822, 218770303, 142390280, 010498940, 982028939, 015890156, 990005577, 991307325
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
2N2222A
Crystalonics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
EU2B-YS2J03C
Idec
ROTARY SWITCH;
KSZ9031RNXIA
Microchip Technology
KSZ9031RNXIA by Microchip is a 48-terminal Ethernet transceiver with data rate of 1000 Mbps. Operating temperature range from -40 to 85°C makes it suitable for industrial applications. This square-shaped chip carrier has a very thin profile and matte tin finish, ideal for network interfaces.
BAV99
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
North American Philips Discrete Products Div
1N4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Concord Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V;
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
2N7002
Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain Current (ID): .115 A; Operating Mode: ENHANCEMENT MODE;
LM107H
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
BSS123-7-F
Diodes Incorporated
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
MBRA160T3G
Onsemi
MBRA160T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.51V. It operates b/w -55 to 150°C, has a reverse test voltage of 60V, and is ideal for power applications due to its high efficiency and small outline package style.
LM358DT
STMicroelectronics
LM358DT by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 9000 uV. It operates at a nominal voltage of 5V and has a min voltage gain of 25000. This amplifier is commonly used in applications requiring high precision and low power consumption.
LM317T
Analog Devices
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; No. of Functions: 1; Package Body Material: PLASTIC/EPOXY; Surface Mount: NO;
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
Promax-johnton
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Terminal Form: GULL WING; Maximum Drain-Source On Resistance: 7.5 ohm; Minimum DS Breakdown Voltage: 60 V;
1554216004
Molex
WIRE AND CABLE;
MAX2351ETI
Analog Devices' MAX2351ETI is a Cellphone IC with BICMOS tech, 28 terminals in a square chip carrier package. Operating temp range -40 to 85 °C, suitable for RF and baseband circuits in telecom applications. Dimensions: 5x5mm, terminal pitch 0.5mm, max seated height 0.9mm.
AD6659BCPZ-80
AD6659BCPZ-80 by Analog Devices is a cellphone IC with 2 functions, operating at 1.8V. It features a square package style with 64 terminals and matte tin finish. Ideal for RF and baseband circuits in telecom applications, it has an industrial temperature grade of -40 to 85 °C.
MAX2042AETP+
Analog Devices' MAX2042AETP+ is a cellphone IC with 20 terminals in a square chip carrier package. Operating at -40 to 85 °C, it has supply voltages of 3.3/5V and consumes 0.162mA max current. Ideal for RF and baseband circuits, this CMOS technology IC is designed for industrial telecom applications.
TRF4400PWG4
Texas Instruments
TRF4400PWG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features CMOS technology, RF and baseband circuit for telecom applications. The package is small outline, thin profile, with shrink pitch, suitable for surface mount assembly.
SARA-R510S-01B
U-blox Ag
RF AND BASEBAND CIRCUIT;
BGA7H1BN6E6327XTSA1
Infineon Technologies
Infineon's BGA7H1BN6E6327XTSA1 is a cellphone IC with 6 terminals, operating temp. range of -40 to 85°C, and supply voltage of 2.8V. It features RF & baseband circuits in a very thin profile chip carrier package for telecom applications.
CC1150RSTG3
CC1150RSTG3 by Texas Instruments is a cellphone IC with 16 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 1.8/3.6V. This RF and baseband circuit has a terminal pitch of 0.65mm, making it ideal for industrial telecom applications.
TRF371125IRGZT
TRF371125IRGZT by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features RF and baseband circuits, suitable for telecom applications. The package style is chip carrier with a very thin profile, making it ideal for compact designs.
ADRF5547BCPZN-RL
Analog Devices' ADRF5547BCPZN-RL is a 40-terminal cellphone IC with a square package shape and chip carrier style. It operates b/w -40 to 105 °C, suitable for industrial telecom applications requiring RF front end circuits. With a nominal voltage of 5V, it features a terminal pitch of 0.5mm and can withstand peak reflow temperature of 260°C for up to 30 seconds.
1166
The Texas Instruments 1166 is a cellphone IC with 20 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features CMOS technology, RF and baseband circuit for telecom applications at 3V supply voltage.
HPA01083RGVR
Texas Instruments' HPA01083RGVR is a cellphone IC with 16 terminals in a square chip carrier package. Operating from -40 to 85°C, it's ideal for RF and baseband circuits. With a compact size of 4x4mm and no-lead terminal form, it suits industrial telecom applications.
MAX2608EUT+
MAX2608EUT+ by Analog Devices is a cellphone IC with 6 terminals in a small outline package. It operates b/w -40 to 85 °C, suitable for industrial use. This baseband circuit has a nominal voltage of 2.75V and peak reflow temperature of 260°C, making it ideal for telecom applications.
CC2591RGVT
The Texas Instruments CC2591RGVT is a cellphone IC with 16 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 85°C, with a supply voltage of 3V and max current of 4mA. This RF front end circuit has a terminal pitch of 0.65mm and is suitable for industrial applications requiring very thin profile components.
TEF8102EN/N1Y
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 2; Peak Reflow Temperature (C): 260;
CC1100-RTY1
CC1100-RTY1 by Texas Instruments is a cellphone IC with 20 terminals, operating at -40 to 85°C. It features a supply voltage of 3V, CMOS technology, and RF/baseband circuitry. This surface-mount chip carrier has a square shape, matte tin finish, and very thin profile for industrial applications.
AD6649BCPZ
AD6649BCPZ by Analog Devices is a cellphone IC with 64 terminals in a square package. It operates at temperatures from -40 to 85°C, with a supply voltage of 1.8V. This RF and baseband circuit has a terminal pitch of 0.5mm and low supply current of 0.3mA, making it ideal for telecom applications.
MAX2605EUT+T
MAX2605EUT+T by Analog Devices is a cellphone IC with 6 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. Telecom applications benefit from its baseband circuit and low profile design.
TRF6903PT
TRF6903PT by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates at -40 to 85°C, with power supplies of 2.5/3.3V. This RF and baseband circuit has a low profile flatpack style for industrial telecom applications.
AT86RF233-ZU
AT86RF233-ZU by Microchip Technology is a cellphone IC with 32 terminals in a square package. It operates at temperatures from -40 to 85°C, with power supplies of 1.8V and 3V. This RF and baseband circuit technology has a terminal pitch of 0.5mm, making it ideal for telecom applications.
LARA-R202-02B
LARA-R202-02B by U-blox Ag is a Cellphone IC with TS 16949 screening. Features RF and baseband circuit for telecom, operates at -20 to 65°C, and requires 3.8V supply voltage. Ideal for compact devices due to its small size of 24x26mm and low seated height of 2.87mm.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
1185
Amecon
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
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