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MAX2676EWT+

Analog Devices

MAX2676EWT+ by Analog Devices

MAX2676EWT+ by Analog Devices is a CELLPHONE IC with BICMOS tech. It operates at -40 to 85 °C, has 3.3V supply, and RF/BASEBAND circuits. The package is GRID ARRAY, 0.69mm height, and 1.27mm length for telecom applications.

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3

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1k+

MAX2676EWT+ by Analog Devices
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Vyrian

USA . 2,665 parts In-Stock

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2,665

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Digiode

USA . 2,650 parts In-Stock

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2,650

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Anansix

USA . 873 parts In-Stock

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873

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MARBEL Systems

Belgium . 7 parts In-Stock

1+ parts

$14.378

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7

$14.378

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Texas Native Microelectronics

USA . 25 parts In-Stock

1+ parts

$16.527

100+ parts

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$15.370

10k+ parts

$14.544

25

$16.527

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$15.370

$14.544

Kenton Components

USA . 2,818 parts In-Stock

1+ parts

$19.832

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$17.453

2,818

$19.832

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$17.453

Qasali Group International

UK . 2,337 parts In-Stock

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$44.623

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2,337

$44.623

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Semicontronic

India . 990 parts In-Stock

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$354.000

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$345.150

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$343.380

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990

$354.000

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$343.380

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Corphita

USA . 899 parts In-Stock

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899

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Overview

Enhance your cellphone's performance with the MAX2676EWT+ by Analog Devices. Known for their high-quality products, Analog Devices delivers top-notch Cellphone ICs that are essential for optimal connectivity and communication. With a focus on reliability and efficiency, this RF and baseband circuit is designed to meet industrial standards while providing a seamless user experience. Upgrade your device today and enjoy the benefits of Analog Devices' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices like cellphones.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the IC onto the PCB, saving time and increasing production efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the IC can withstand demanding conditions, providing reliability and longevity in cellphone applications.

Technology: BICMOS

BICMOS technology offers a combination of bipolar and CMOS technologies, enabling high performance and low power consumption in cellphone circuitry.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is commonly used in cellphone applications, ensuring compatibility with existing power systems.

Technical Specifications

Cellphone ICs MAX2676EWT+ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PBGA-B6

JESD-609 Code:

e2

Length:

1.27 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.69 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER NICKEL

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.865 mm

Trade Compliance

MAX2676EWT+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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